SLLSFZ6 November 2024 TUSB5461-Q1
ADVANCE INFORMATION
For this design example, use the parameters shown in Table 8-1.
PARAMETER | VALUE | |
---|---|---|
USB3 pre-channel A to B PCB trace length, XAB. Refer to Figure 8-1. | 2 inches ≤ XAB ≤ 12 inches – [MAX (XEF or XGH)] | |
DP pre-channel C to D PCB trace length, XCD. Refer to Figure 8-1. | 2 inches ≤ XCD ≤ 12 inches – [MAX (XEF or XGH)] | |
USB and DP post channel E to F PCB trace length, XEF. Refer to Figure 8-1. | up to 4 inches | |
USB and DP post channel G to H PCB trace length, XGH. Refer to Figure 8-1. | up to 4 inches | |
Maximum distance of ESD component from the USB-C receptacle, LESD | 0.5 inches | |
Maximum distance of series resistor (RESD) from ESD component, LR_ESD. | 0.25 inches | |
CAC-USB1 AC-coupling capacitor (75nF to 265nF) | 220nF | |
CAC-USB2 AC-coupling capacitor (297nF to 363nF) | Options:
| |
Optional RRX resistor (220kΩ ±5%) | 220kΩ | |
CAC-DP AC-coupling capacitor (75nF to 265nF) | 220nF | |
RESD (0Ω to 2.2Ω) | 1Ω | |
VCC supply (3V to 3.6V) | 3.3V | |
I2C Mode or GPIO Mode | I2C Mode. (I2C_EN pin != "0") | |
1.8V or 3.3V I2C Interface | 3.3V I2C. Pull up the I2C_EN pin to 3.3V with a 1KΩ resistor. |