SLLSFO9A May   2024  – September 2024 TUSB564-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 USB 3.2
      2. 7.3.2 DisplayPort
      3. 7.3.3 4-Level Inputs
      4. 7.3.4 Receiver Linear Equalization
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Configuration in GPIO Mode
      2. 7.4.2 Device Configuration In I2C Mode
      3. 7.4.3 DisplayPort Mode
      4. 7.4.4 Linear EQ Configuration
      5. 7.4.5 USB3 Modes
      6. 7.4.6 Operation Timing – Power Up
    5. 7.5 Programming
      1. 7.5.1 TUSB564-Q1 I2C Target Behavior
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 ESD Protection
        2. 8.2.2.2 Support for DisplayPort UFP_D Pin Assignment E
      3. 8.2.3 Application Curve
    3. 8.3 System Examples
      1. 8.3.1 USB 3.1 Only
      2. 8.3.2 USB 3.1 and 2 Lanes of DisplayPort
      3. 8.3.3 DisplayPort Only
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Register Maps
    1. 9.1 General Register (address = 0x0A) [reset = 00000001]
    2. 9.2 DisplayPort Control/Status Registers (address = 0x10) [reset = 00000000]
    3. 9.3 DisplayPort Control/Status Registers (address = 0x11) [reset = 00000000]
    4. 9.4 DisplayPort Control/Status Registers (address = 0x12) [reset = 00000000]
    5. 9.5 DisplayPort Control/Status Registers (address = 0x13) [reset = 00000000]
    6. 9.6 USB3.1 Control/Status Registers (address = 0x20) [reset = 00000000]
    7. 9.7 USB3.1 Control/Status Registers (address = 0x21) [reset = 00000000]
    8. 9.8 USB3.1 Control/Status Registers (address = 0x22) [reset = 00000000]
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) Device UNIT
RGF (VQFN)
40 PINS
RθJA Junction-to-ambient thermal resistance 29.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 18.6 °C/W
RθJB Junction-to-board thermal resistance 10.8 °C/W
ΨJT Junction-to-top characterization parameter 0.3 °C/W
ΨJB Junction-to-board characterization parameter 10.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 3.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.