SLLSEF6C July   2014  – June 2017 TUSB8020B

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (continued)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 3.3-V I/O Electrical Characteristics
    6. 7.6 Power-Up Timing Requirements
    7. 7.7 Hub Input Supply Current
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Battery Charging Features
      2. 8.3.2 USB Power Management
      3. 8.3.3 One-Time Programmable (OTP) Configuration
      4. 8.3.4 Clock Generation
        1. 8.3.4.1 Crystal Requirements
        2. 8.3.4.2 Input Clock Requirements
      5. 8.3.5 Power-Up and Reset
    4. 8.4 Device Functional Modes
      1. 8.4.1 External Configuration Interface
      2. 8.4.2 I2C EEPROM Operation
      3. 8.4.3 SMBus Slave Operation
    5. 8.5 Register Maps
      1. 8.5.1 Configuration Registers
        1. 8.5.1.1  ROM Signature Register (offset = 0h) [reset = 0h]
        2. 8.5.1.2  Vendor ID LSB Register (offset = 1h) [reset = 51h]
        3. 8.5.1.3  Vendor ID MSB Register (offset = 2h) [reset = 4h]
        4. 8.5.1.4  Product ID LSB Register (offset = 3h) [reset = 25h]
        5. 8.5.1.5  Product ID MSB Register (offset = 4h) [reset = 80h]
        6. 8.5.1.6  Device Configuration Register (offset = 5h) [reset = 1Xh]
        7. 8.5.1.7  Battery Charging Support Register (offset = 6h) [reset = 0Xh]
        8. 8.5.1.8  Device Removable Configuration Register (offset = 7h) [reset = 0Xh]
        9. 8.5.1.9  Port Used Configuration Register (offset = 8h) [reset = 0h]
        10. 8.5.1.10 PHY Custom Configuration Register (offset = 9h) [reset = 0h]
        11. 8.5.1.11 Device Configuration Register 2 (offset = Ah)
        12. 8.5.1.12 UUID Registers (offset = 10h to 1Fh)
        13. 8.5.1.13 Language ID LSB Register (offset = 20h)
        14. 8.5.1.14 Language ID MSB Register (offset = 21h)
        15. 8.5.1.15 Serial Number String Length Register (offset = 22h)
        16. 8.5.1.16 Manufacturer String Length Register (offset = 23h)
        17. 8.5.1.17 Product String Length Register (offset = 24h)
        18. 8.5.1.18 Serial Number Registers (offset = 30h to 4Fh)
        19. 8.5.1.19 Manufacturer String Registers (offset = 50h to 8Fh)
        20. 8.5.1.20 Product String Registers (offset = 90h to CFh)
        21. 8.5.1.21 Additional Feature Configuration Register (offset = F0h)
        22. 8.5.1.22 Charging Port Control Register (offset = F2h)
        23. 8.5.1.23 Device Status and Command Register (offset = F8h)
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Upstream Port Implementation
        2. 9.2.2.2 Downstream Port 1 Implementation
        3. 9.2.2.3 Downstream Port 2 Implementation
        4. 9.2.2.4 VBUS Power Switch Implementation
        5. 9.2.2.5 Clock, Reset, and Miscellaneous
        6. 9.2.2.6 Power Implementation
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply
    2. 10.2 Downstream Port Power
    3. 10.3 Ground
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Placement
      2. 11.1.2 Package Specific
      3. 11.1.3 Differential Pairs
    2. 11.2 Layout Example
      1. 11.2.1 Upstream Port
      2. 11.2.2 Downstream Port
      3. 11.2.3 Thermal Pad
  12. 12Device and Documentation Support
    1. 12.1 Community Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Device and Documentation Support

Community Resources

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Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.