SLLSEE5D february   2013  – july 2023 TUSB8040A1

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Revision History
  6. 5Pin Configuration and Functions
  7. 6Specifications
    1. 6.1 Absolute Maximum Ratings #GUID-9FC00080-214A-41B8-A47D-B9F7BA87DE22/SLLSE42922
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 3.3-V I/O Electrical Characteristics
    6. 6.6 Hub Input Supply Current
    7. 6.7 Timing and Switching Characteristics
      1. 6.7.1 Clock Generation
      2. 6.7.2 Crystal Requirements
      3. 6.7.3 Input Clock Requirements
  8. 7Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Memory
    4. 7.4 I2C EEPROM Operation
    5. 7.5 SMBus Target Operation
    6. 7.6 Configuration Registers
      1. 7.6.1  ROM Signature Register
      2. 7.6.2  Vendor ID LSB Register
      3. 7.6.3  Vendor ID MSB Register
      4. 7.6.4  Product ID LSB Register
      5. 7.6.5  Product ID MSB Register
      6. 7.6.6  Device Configuration Register
      7. 7.6.7  Battery Charging Support Register
      8. 7.6.8  Device Removable Configuration Register
      9. 7.6.9  Port Used Configuration Register
      10. 7.6.10 Reserved Register
      11. 7.6.11 Reserved Register
      12. 7.6.12 Language ID LSB Register
      13. 7.6.13 Language ID MSB Register
      14. 7.6.14 Serial Number String Length Register
      15. 7.6.15 Manufacturer String Length Register
      16. 7.6.16 Product String Length Register
      17. 7.6.17 Reserved Register
      18. 7.6.18 Serial Number Registers
      19. 7.6.19 Manufacturer String Registers
      20. 7.6.20 Product String Registers
      21. 7.6.21 Additional Feature Configuration Register
      22. 7.6.22 Reserved Register
      23. 7.6.23 Reserved Register
      24. 7.6.24 Device Status and Command Register
  9. 8Applications, Implementation, and Layout
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Upstream Port Implementation
        2. 8.2.2.2 Downstream Port 1 Implementation
        3. 8.2.2.3 Downstream Port 2 Implementation
        4. 8.2.2.4 Downstream Port 3 Implementation
        5. 8.2.2.5 Downstream Port 4 Implementation
        6. 8.2.2.6 VBUS Power Switch Implementation
        7. 8.2.2.7 Clock, Reset, I2C/SMBUS, and Misc
        8. 8.2.2.8 Power Implementation
      3. 8.2.3 Application Curve
      4. 8.2.4 Power Supply Recommendations
        1. 8.2.4.1 Power Up and Reset
      5. 8.2.5 Layout
        1. 8.2.5.1 Layout Guidelines
          1. 8.2.5.1.1 Part Placement
          2. 8.2.5.1.2 Board Layout Considerations
            1. 8.2.5.1.2.1  RKM Package – QFN (Quad Flat No-Lead)
            2. 8.2.5.1.2.2  Impedance
            3. 8.2.5.1.2.3  Critical Signals
            4. 8.2.5.1.2.4  Crystal
            5. 8.2.5.1.2.5  USB Interface
            6. 8.2.5.1.2.6  Differential Pair Signals
              1. 8.2.5.1.2.6.1 Internal Bond Wire Mismatch
            7. 8.2.5.1.2.7  Port Connectors
            8. 8.2.5.1.2.8  Reset Terminals
            9. 8.2.5.1.2.9  Miscellaneous Terminals
            10. 8.2.5.1.2.10 Power Control and Battery Charging Terminals
            11. 8.2.5.1.2.11 USB 2.0 Port Indicator LED Terminals
          3. 8.2.5.1.3 Power
            1. 8.2.5.1.3.1 Power
            2. 8.2.5.1.3.2 Downstream Port Power
            3. 8.2.5.1.3.3 Ground
        2. 8.2.5.2 Layout Example
  10. 9Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11.   Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information
8.2.5.1.1 Part Placement
  • If possible, place all active components on the top layer of the board stack up.
  • Place the crystal as close as possible to the TUSB8040A1, and on the top layer of the board stack up to avoid the use of any vias in the clock trace.
  • Place the voltage regulators as far away as possible from the TUSB8040A1, the crystal, and the differential pairs.
  • Place the TUSB8040A1 apart from the USB connectors (if possible).
  • Place the SuperSpeed (SS) transmit differential pair capacitors as close as possible to the USB connector pins. The ESD protection device (if used) should also be placed as close as possible to the USB connectors.
  • In general, the bulk capacitors associated with each power rail should be placed as close as possible to the voltage regulators.