SLLSF94 June   2019 TUSB8043A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Diagram
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Battery Charging Features
      2. 8.3.2 USB Power Management
      3. 8.3.3 I2C Programming Support Using Internal HID to I2C Interface
        1. 8.3.3.1 SET REPORT (Output)
        2. 8.3.3.2 GET REPORT (Feature)
        3. 8.3.3.3 GET REPORT (Input)
      4. 8.3.4 One Time Programmable (OTP) Configuration
      5. 8.3.5 Clock Generation
      6. 8.3.6 Crystal Requirements
      7. 8.3.7 Input Clock Requirements
      8. 8.3.8 Power-Up and Reset
    4. 8.4 Device Functional Modes
      1. 8.4.1 External Configuration Interface
      2. 8.4.2 I2C EEPROM Operation
      3. 8.4.3 Port Configuration
      4. 8.4.4 SMBus Slave Operation
    5. 8.5 Register Maps
      1. 8.5.1  Configuration Registers
      2. 8.5.2  ROM Signature Register
        1. Table 7. Bit Descriptions – ROM Signature Register
      3. 8.5.3  Vendor ID LSB Register
        1. Table 8. Bit Descriptions – Vendor ID LSB Register
      4. 8.5.4  Vendor ID MSB Register
        1. Table 9. Bit Descriptions – Vendor ID MSB Register
      5. 8.5.5  Product ID LSB Register
        1. Table 10. Bit Descriptions – Product ID LSB Register
      6. 8.5.6  Product ID MSB Register
        1. Table 11. Bit Descriptions – Product ID MSB Register
      7. 8.5.7  Device Configuration Register
        1. Table 12. Bit Descriptions – Device Configuration Register
      8. 8.5.8  Battery Charging Support Register
        1. Table 13. Bit Descriptions – Battery Charging Support Register
      9. 8.5.9  Device Removable Configuration Register
        1. Table 14. Bit Descriptions – Device Removable Configuration Register
      10. 8.5.10 Port Used Configuration Register
        1. Table 15. Bit Descriptions – Port Used Configuration Register
      11. 8.5.11 Device Configuration Register 2
        1. Table 16. Bit Descriptions – Device Configuration Register 2
      12. 8.5.12 USB 2.0 Port Polarity Control Register
        1. Table 17. Bit Descriptions – USB 2.0 Port Polarity Control Register
      13. 8.5.13 UUID Registers
        1. Table 18. Bit Descriptions – UUID Byte N Register
      14. 8.5.14 Language ID LSB Register
        1. Table 19. Bit Descriptions – Language ID LSB Register
      15. 8.5.15 Language ID MSB Register
        1. Table 20. Bit Descriptions – Language ID MSB Register
      16. 8.5.16 Serial Number String Length Register
        1. Table 21. Bit Descriptions – Serial Number String Length Register
      17. 8.5.17 Manufacturer String Length Register
        1. Table 22. Bit Descriptions – Manufacturer String Length Register
      18. 8.5.18 Product String Length Register
        1. Table 23. Bit Descriptions – Product String Length Register
      19. 8.5.19 Device Configuration Register 3
        1. Table 24. Bit Descriptions – Device Configuration Register 3
      20. 8.5.20 USB 2.0 Only Port Register
        1. Table 25. Bit Descriptions – USB 2.0 Only Port Register
      21. 8.5.21 Serial Number String Registers
        1. Table 26. Bit Descriptions – Serial Number Registers
      22. 8.5.22 Manufacturer String Registers
        1. Table 27. Bit Descriptions – Manufacturer String Registers
      23. 8.5.23 Product String Registers
        1. Table 28. Bit Descriptions – Product String Byte N Register
      24. 8.5.24 Additional Feature Configuration Register
        1. Table 29. Bit Descriptions – Additional Feature Configuration Register
      25. 8.5.25 SMBus Device Status and Command Register
        1. Table 30. Bit Descriptions – SMBus Device Status and Command Register
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Discrete USB Hub Product
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Upstream Port Implementation
          2. 9.2.1.2.2 Downstream Port 1 Implementation
          3. 9.2.1.2.3 Downstream Port 2 Implementation
          4. 9.2.1.2.4 Downstream Port 3 Implementation
          5. 9.2.1.2.5 Downstream Port 4 Implementation
          6. 9.2.1.2.6 VBUS Power Switch Implementation
          7. 9.2.1.2.7 Clock, Reset, and Misc
          8. 9.2.1.2.8 TUSB8043A Power Implementation
        3. 9.2.1.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 TUSB8043A Power Supply
    2. 10.2 Downstream Port Power
    3. 10.3 Ground
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Placement
      2. 11.1.2 Package Specific
      3. 11.1.3 Differential Pairs
    2. 11.2 Layout Examples
      1. 11.2.1 Upstream Port
      2. 11.2.2 Downstream Port
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply Voltage Range VDD Supply voltage range -0.3 1.4 V
VDD33 Supply voltage range -0.3 3.8 V
Voltager Range USB_SSRXP_UP, USB_SSRXN_UP, SSRXP_DN[4:1], USB_RXN_DP[4:1] and USB_VBUS terminals -0.3 1,4 V
XI terminal -0.3 2.45 V
All other terminals -0.3 3.8 V
Tstg Storage temperature -65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.