SLVSEQ2B September   2018  – November 2021 TVS1401

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings - JEDEC
    3. 8.3 ESD Ratings - IEC
    4. 8.4 Recommended Operating Conditions
    5. 8.5 Thermal Information
    6. 8.6 Electrical Characteristics
    7. 8.7 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
      1. 9.4.1 Protection Specifications
      2. 9.4.2 Reliability Testing
      3. 9.4.3 Zero Derating
      4. 9.4.4 Bidirectional Operation
      5. 9.4.5 Transient Performance
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.6 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
ILEAKLeakage CurrentMeasured at VIN = ±VRWM, TA = 27°C1.130nA
Measured at VIN = ±VRWM, TA = 85°C260
VBRBreak-down VoltageIIN = ±1mA17.117.6V
VCLAMPClamp Voltage±Ipp IEC 61000-4-5 Surge (8/20 µs), VIN = 0 V before surge, TA = 27°C20.522.2V
±IPP IEC 61000-4-5 Surge (8/20 µs), VIN =±VRWM before surge, TA = 125°C23.55
RDYN8/20 µs surge dynamic resistanceCalculated from VCLAMP at .5*IPP and IPP surge current, TA = 25°C70mΩ
CINInput pin capacitanceVIN = VRWM, f = 1 MHz, 30 mVpp, IO to GND68pF
SRMaximum Slew Rate0-±VRWM rising edge, sweep rise time and measure slew rate when IPEAK = 1 mA, TA = 27°C2.5V/µs
0-±VRWM rising edge, sweep rise time and measure slew rate when IPEAK = 1 mA, TA = 85°C1