SLVSDO2C
February 2017 – February 2018
TVS3300
PRODUCTION DATA.
1
Features
2
Applications
3
Description
Device Images
Footprint Comparison
Voltage Clamp Response to 8/20 µs Surge Event
4
Revision History
5
Device Comparison Table
6
Pin Configuration and Functions
Pin Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings - JEDEC
7.3
ESD Ratings - IEC
7.4
Recommended Operating Conditions
7.5
Thermal Information
7.6
Electrical Characteristics
7.7
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.4
Reliability Testing
8.5
Device Functional Modes
8.5.1
Protection Specifications
8.5.2
Minimal Derating
8.5.3
Transient Performance
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.3
PLC Surge Protection Reference Design
9.2.4
Configuration Options
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Documentation Support
12.1.1
Related Documentation
12.2
Receiving Notification of Documentation Updates
12.3
Community Resources
12.4
Trademarks
12.5
Electrostatic Discharge Caution
12.6
Glossary
13
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DRV|6
MPDS216E
YZF|4
MXBG369
Thermal pad, mechanical data (Package|Pins)
DRV|6
QFND087M
Orderable Information
slvsdo2c_oa
slvsdo2c_pm
7.7
Typical Characteristics
Figure 1.
8/20 µs Surge Response at 35 A
f = 1 MHz, 30 mVpp, IO to GND
Figure 3.
Capacitance vs Temperature Across Bias
Figure 5.
I/V Curve Across Temperature
Figure 7.
Breakdown Voltage (1 mA) vs Temperature
Figure 9.
Dynamic Leakage vs Signal Slew Rate across Temperature
Figure 2.
8/20 µs Surge Response at 35 A Across Temperature
Figure 4.
Leakage Current vs Temperature at 33 V
Figure 6.
Forward Voltage vs Temperature
Figure 8.
Max Surge Current (8/20 µs) vs Temperature