SBOS975 March   2019 TX7332

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
    1.     Simplified Block Diagram
  4. 4Revision History
  5. 5Description (continued)
  6. 6Device and Documentation Support
    1. 6.1 Receiving Notification of Documentation Updates
    2. 6.2 Community Resources
    3. 6.3 Trademarks
    4. 6.4 Electrostatic Discharge Caution
    5. 6.5 Glossary
  7. 7Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The TX7332 is a highly integrated, high-performance transmitter solution for ultrasound imaging system. The device has total 32 pulser circuits (PULS), 32 transmit/receive (T/R) switches, and supports both on-chip and off-chip beamformer (TxBF). The device also integrates on-chip floating power supplies that reduce the number of required high voltage power supplies.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
TX7332 NFBGA (260) 17.00 mm × 11.00 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Simplified Block Diagram

TX7332 fbd_pg1_sbos851.gif