SBASB48 June   2024 TX73H32

ADVANCE INFORMATION  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Device and Documentation Support
    1. 4.1 Documentation Support
    2. 4.2 Receiving Notification of Documentation Updates
    3. 4.3 Support Resources
    4. 4.4 Trademarks
    5. 4.5 Electrostatic Discharge Caution
    6. 4.6 Glossary
  6. 5Revision History
  7. 6Mechanical, Packaging, and Orderable Information
    1. 6.1 Package Option Addendum

Package Options

Mechanical Data (Package|Pins)
  • ACP|196
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • Transmitter supports:
    • 32-channel 3-level pulser and active transmit/ receive (T/R) switch
  • 3-level pulser:
    • Maximum output voltage: ±100V
    • Minimum output voltage: ±1V
    • Maximum output current: 2A
    • True return to zero to discharge output to ground
    • Second harmonic of –40dBc at 5MHz
    • –3-dB Bandwidth with 220Ω || 220pF load
      • 22MHz for a ±100V supply
    • Very low receive power: 0.2mW/ch
  • Active transmit/receive (T/R) switch with:
    • Turn on resistance of 13Ω
    • Turn on and Turn off time: 100ns
    • Transient glitch: 10mVPP
  • On-chip beam former with:
    • Channel based T/R switch on and off controls
    • Delay resolution: half beamformer clock period, minimum 2.5ns
    • Maximum delay: 214 beamformer clock period
    • Maximum beamformer clockspeed: 200MHz
    • On-Chip RAM for pattern and delay profile
    • One 512 × 32 memory to store beam-former pattern and delay for a group of 2 channels
    • Global repeat feature present, enabling long-duration patterns
  • High-speed (400MHz maximum), 2-lane LVDS serial programming interface.
    • Low programming time: ≈1.5µs for delay profile update
    • 32-bit Checksum to detect wrong SPI writes
  • Supports CMOS serial programming interface (50MHz maximum)
  • High-reliability features:
    • Internal temperature sensor and automatic thermal shutdown
    • No specific power sequencing requirement
    • Error flag register to detect faulty conditions
    • Integrated passives for the floating supplies and bias voltages
    • Small package: FC-BGA-196 (12mm × 12mm) with 0.8mm pitch