SBASB48 June   2024 TX73H32

ADVANCE INFORMATION  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Device and Documentation Support
    1. 4.1 Documentation Support
    2. 4.2 Receiving Notification of Documentation Updates
    3. 4.3 Support Resources
    4. 4.4 Trademarks
    5. 4.5 Electrostatic Discharge Caution
    6. 4.6 Glossary
  6. 5Revision History
  7. 6Mechanical, Packaging, and Orderable Information
    1. 6.1 Package Option Addendum

Package Options

Mechanical Data (Package|Pins)
  • ACP|196
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.5 Electrostatic Discharge Caution

TX73H32 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.