SBASB48 June   2024 TX73H32

ADVANCE INFORMATION  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Device and Documentation Support
    1. 4.1 Documentation Support
    2. 4.2 Receiving Notification of Documentation Updates
    3. 4.3 Support Resources
    4. 4.4 Trademarks
    5. 4.5 Electrostatic Discharge Caution
    6. 4.6 Glossary
  6. 5Revision History
  7. 6Mechanical, Packaging, and Orderable Information
    1. 6.1 Package Option Addendum

Package Options

Mechanical Data (Package|Pins)
  • ACP|196
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

TX73H32 is a highly integrated, high-performance transmitter device for ultrasound imaging system. The device has a total of 32 pulser circuits, 32 transmit/ receive switches (referred to as T/R or TR switches) and supports on-chip beamformer (TxBF). The device also integrates on-chip floating power supplies that reduce the number of required high-voltage power supplies.

TX73H32 has a pulser circuit that generates three-level high voltage pulses (up to ±100V) that is used to excite multiple channels of an ultrasound transducer. The device supports total 32 outputs. The maximum output current is 2A.

Device can be used as a transmitter for many applications like ultrasound imaging, non-destructive testing, SONAR, LIDAR, marine navigation system, brain imaging systems and so on.

Package Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2)
TX73H32 FC-BGA-196 12.0mm × 12.0mm
(1) For all available packages, see the orderable addendum at the end of the data sheet.
(2) The package size (length × width) is a nominal value and includes pins, where applicable
TX73H32 Simplified Block Diagram Simplified Block Diagram