SCES641E May   2007  – October 2023 TXB0102

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: TA = 25°C
    6. 5.6  Electrical Characteristics: TA = –40°C to +85°C
    7. 5.7  Operating Characteristics
    8. 5.8  VCCA = 1.2 V Timing Requirements
    9. 5.9  VCCA = 1.5 V ± 0.1 V Timing Requirements
    10. 5.10 VCCA = 1.8 V ± 0.15 V Timing Requirements
    11. 5.11 VCCA = 2.5 V ± 0.2 V Timing Requirements
    12. 5.12 VCCA = 3.3 V ± 0.3 V Timing Requirements
    13. 5.13 VCCA = 1.2 V Switching Characteristics
    14. 5.14 VCCA = 1.5 V ± 0.1 V Switching Characteristics
    15. 5.15 VCCA = 1.8 V ± 0.15 V Switching Characteristics
    16. 5.16 VCCA = 2.5 V ± 0.2 V Switching Characteristics
    17. 5.17 VCCA = 3.3 V ± 0.3 V Switching Characteristics
    18. 5.18 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Architecture
      2. 7.3.2 Input Driver Requirements
      3. 7.3.3 Output Load Considerations
      4. 7.3.4 Enable and Disable
      5. 7.3.5 Pullup or Pulldown Resistors on I/O Lines
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4.1 Layout Guidelines

Follow common PCB layout guidelines to assure reliability of the device.

Bypass capacitors must be used on power suppliesand placed as close as possible to the VCCA, VCCB pin, and GND pin.

Short trace lengths must be used to avoid excessive loading.

PCB signal trace-lengths must be kept short enough so that the round-trip delay of any reflection is less than the oneshot duration, approximately 10 ns, assuring that any reflection encounters low impedance at the source driver.