SCES641E May   2007  – October 2023 TXB0102

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: TA = 25°C
    6. 5.6  Electrical Characteristics: TA = –40°C to +85°C
    7. 5.7  Operating Characteristics
    8. 5.8  VCCA = 1.2 V Timing Requirements
    9. 5.9  VCCA = 1.5 V ± 0.1 V Timing Requirements
    10. 5.10 VCCA = 1.8 V ± 0.15 V Timing Requirements
    11. 5.11 VCCA = 2.5 V ± 0.2 V Timing Requirements
    12. 5.12 VCCA = 3.3 V ± 0.3 V Timing Requirements
    13. 5.13 VCCA = 1.2 V Switching Characteristics
    14. 5.14 VCCA = 1.5 V ± 0.1 V Switching Characteristics
    15. 5.15 VCCA = 1.8 V ± 0.15 V Switching Characteristics
    16. 5.16 VCCA = 2.5 V ± 0.2 V Switching Characteristics
    17. 5.17 VCCA = 3.3 V ± 0.3 V Switching Characteristics
    18. 5.18 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Architecture
      2. 7.3.2 Input Driver Requirements
      3. 7.3.3 Output Load Considerations
      4. 7.3.4 Enable and Disable
      5. 7.3.5 Pullup or Pulldown Resistors on I/O Lines
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.3 Output Load Considerations

TI recommends careful printed-circuit board (PCB) layout practices with short PCB trace lengths to avoid excessive capacitive loading and to assure that proper O.S. triggering takes place. PCB signal trace-lengths must be kept short enough such that the round trip delay of any reflection is less than the one-shot duration. This improves signal integrity by assuring that any reflection sees a low impedance at the driver. The O.S. circuits have been designed to stay on for approximately 10 ns. The maximum capacitance of the lumped load that is driven also depends directly on the one-shot duration. With heavy capacitive loads, the one-shot can time-out before the signal is driven fully to the positive rail. The O.S. duration has been set to best optimize trade-offs between dynamic ICC, load driving capability, and maximum bit-rate considerations. Both PCB trace length and connectors add to the capacitance that the TXB0102 output sees, so TI recommends that this lumped-load capacitance be considered to avoid O.S. retriggering, bus contention, output signal oscillations, or other adverse system-level affects.