SCES641E May   2007  – October 2023 TXB0102

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: TA = 25°C
    6. 5.6  Electrical Characteristics: TA = –40°C to +85°C
    7. 5.7  Operating Characteristics
    8. 5.8  VCCA = 1.2 V Timing Requirements
    9. 5.9  VCCA = 1.5 V ± 0.1 V Timing Requirements
    10. 5.10 VCCA = 1.8 V ± 0.15 V Timing Requirements
    11. 5.11 VCCA = 2.5 V ± 0.2 V Timing Requirements
    12. 5.12 VCCA = 3.3 V ± 0.3 V Timing Requirements
    13. 5.13 VCCA = 1.2 V Switching Characteristics
    14. 5.14 VCCA = 1.5 V ± 0.1 V Switching Characteristics
    15. 5.15 VCCA = 1.8 V ± 0.15 V Switching Characteristics
    16. 5.16 VCCA = 2.5 V ± 0.2 V Switching Characteristics
    17. 5.17 VCCA = 3.3 V ± 0.3 V Switching Characteristics
    18. 5.18 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Architecture
      2. 7.3.2 Input Driver Requirements
      3. 7.3.3 Output Load Considerations
      4. 7.3.4 Enable and Disable
      5. 7.3.5 Pullup or Pulldown Resistors on I/O Lines
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)TXB0102UNIT
DCT (VSSOP)DCU (VSSOP)YZP (VSSOP)
8 PINS8 PINS8 PINS
RθJAJunction-to-ambient thermal resistance168.7199.1105.8°C/W
RθJC(top)Junction-to-case (top) thermal resistance111.772.41.6°C/W
RθJBJunction-to-board thermal resistance78.177.810.8°C/W
ψJTJunction-to-top characterization parameter45.06.23.1°C/W
ψJBJunction-to-board characterization parameter77.577.410.9°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.