SCES641E May   2007  – October 2023 TXB0102

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: TA = 25°C
    6. 5.6  Electrical Characteristics: TA = –40°C to +85°C
    7. 5.7  Operating Characteristics
    8. 5.8  VCCA = 1.2 V Timing Requirements
    9. 5.9  VCCA = 1.5 V ± 0.1 V Timing Requirements
    10. 5.10 VCCA = 1.8 V ± 0.15 V Timing Requirements
    11. 5.11 VCCA = 2.5 V ± 0.2 V Timing Requirements
    12. 5.12 VCCA = 3.3 V ± 0.3 V Timing Requirements
    13. 5.13 VCCA = 1.2 V Switching Characteristics
    14. 5.14 VCCA = 1.5 V ± 0.1 V Switching Characteristics
    15. 5.15 VCCA = 1.8 V ± 0.15 V Switching Characteristics
    16. 5.16 VCCA = 2.5 V ± 0.2 V Switching Characteristics
    17. 5.17 VCCA = 3.3 V ± 0.3 V Switching Characteristics
    18. 5.18 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Architecture
      2. 7.3.2 Input Driver Requirements
      3. 7.3.3 Output Load Considerations
      4. 7.3.4 Enable and Disable
      5. 7.3.5 Pullup or Pulldown Resistors on I/O Lines
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from Revision D (September 2017) to Revision E (October 2023)

  • Updated the numbering format for tables, figures, and cross-references throughout the document. Go

Changes from Revision C (December 2014) to Revision D (September 2017)

  • Added Junction temperature, TJ in Absolute Maximum Ratings Go

Changes from Revision B (March 2012) to Revision C (December 2014)

  • Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from Revision A (January 2011) to Revision B (March 2012)

  • Added notes to pin out graphics.Go

Changes from Revision * (May 2007) to Revision A ()

  • Added ball labels to the YZP Package.Go