SCES791A August   2009  – April 2018 TXB0106-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Operating Circuit
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements – VCCA = 1.2 V, TA = 25°C
    7. 6.7  Timing Requirements – VCCA = 1.5 V ± 0.1 V
    8. 6.8  Timing Requirements – VCCA = 1.8 V ± 0.15 V
    9. 6.9  Timing Requirements – VCCA = 2.5 V ± 0.2 V
    10. 6.10 Timing Requirements – VCCA = 3.3 V ± 0.3 V
    11. 6.11 Switching Characteristics –VCCA = 1.2 V, TA = 25°C
    12. 6.12 Switching Characteristics – VCCA = 1.5 V ± 0.1 V
    13. 6.13 Switching Characteristics – VCCA = 1.8 V ± 0.15 V
    14. 6.14 Switching Characteristics – VCCA = 2.5 V ± 0.2 V
    15. 6.15 Switching Characteristics – VCCA = 3.3 V ± 0.3 V
    16. 6.16 Operating Characteristics
    17. 6.17 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Architecture
      2. 8.3.2 Input Driver Requirements
      3. 8.3.3 Power Up
      4. 8.3.4 Output Load Considerations
      5. 8.3.5 Enable and Disable
      6. 8.3.6 Pullup or Pulldown Resistors on I/O Lines
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.