SCES854A May   2014  – September 2017 TXS0102-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements — VCCA = 1.8 V ± 0.15 V
    7. 6.7  Timing Requirements — VCCA = 2.5 V ± 0.2 V
    8. 6.8  Timing Requirements — VCCA = 3.3 V ± 0.3 V
    9. 6.9  Switching Characteristics — VCCA = 1.8 V ± 0.15 V
    10. 6.10 Switching Characteristics — VCCA = 2.5 V ± 0.2 V
    11. 6.11 Switching Characteristics — VCCA = 3.3 V ± 0.3 V
    12. 6.12 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Load Circuits
    2. 7.2 Voltage Waveforms
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Architecture
      2. 8.3.2 Input Driver Requirements
      3. 8.3.3 Power Up
      4. 8.3.4 Enable and Disable
      5. 8.3.5 Pullup and Pulldown Resistors on I/O Lines
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Layout

11.1 Layout Guidelines

To assure reliability of the device, following common printed-circuit board layout guidelines is recommended.

  • Bypass capacitors should be used on power supplies.
  • Short trace lengths should be used to avoid excessive loading.
  • PCB signal trace-lengths must be kept short enough so that the round-trip delay of any reflection is less than the one shot duration, approximately 30 ns, assuring that any reflection encounters low impedance at the source driver.
  • To help adjust rise and fall times of signals depending on system requirements, place pads on the signal paths for loading capacitors or pullup resistors.

11.2 Layout Example

TXS0102-Q1 TXS0102-Q1-layout-ces854.gif Figure 13. TXS0102-Q1 Layout Example