SCES640J january   2007  – july 2023 TXS0102

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements: VCCA = 1.8 V ±0.15 V
    7. 6.7  Timing Requirements: VCCA = 2.5 V ± 0.2 V
    8. 6.8  Timing Requirements: VCCA = 3.3 V ± 0.3 V
    9. 6.9  Switching Characteristics: VCCA = 1.8 V ± 0.15 V
    10. 6.10 Switching Characteristics: VCCA = 2.5 V ± 0.2 V
    11. 6.11 Switching Characteristics: VCCA = 3.3 V ± 0.3 V
    12. 6.12 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Architecture
      2. 8.3.2 Input Driver Requirements
      3. 8.3.3 Output Load Considerations
      4. 8.3.4 Enable and Disable
      5. 8.3.5 Pullup or Pulldown Resistors on I/O Lines
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)TXS0102UNIT
DCTDCUDQEDQMYZP
8 PINS8 PINS8 PINS8 PINS8 PINS
RθJAJunction-to-ambient thermal resistance182.6199.1199.3239.3105.8°C/W
RθJC(top)Junction-to-case (top) thermal resistance113.372.426.4106.71.6°C/W
RθJBJunction-to-board thermal resistance94.977.878.6130.410.8°C/W
ψJTJunction-to-top characterization parameter39.46.25.98.23.1°C/W
ψJBJunction-to-board characterization parameter93.977.478.0130.210.8°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance—————°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.