SCES640J january   2007  – july 2023 TXS0102

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements: VCCA = 1.8 V ±0.15 V
    7. 6.7  Timing Requirements: VCCA = 2.5 V ± 0.2 V
    8. 6.8  Timing Requirements: VCCA = 3.3 V ± 0.3 V
    9. 6.9  Switching Characteristics: VCCA = 1.8 V ± 0.15 V
    10. 6.10 Switching Characteristics: VCCA = 2.5 V ± 0.2 V
    11. 6.11 Switching Characteristics: VCCA = 3.3 V ± 0.3 V
    12. 6.12 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Architecture
      2. 8.3.2 Input Driver Requirements
      3. 8.3.3 Output Load Considerations
      4. 8.3.4 Enable and Disable
      5. 8.3.5 Pullup or Pulldown Resistors on I/O Lines
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.4.1 Layout Guidelines

To ensure reliability of the device, the following common printed-circuit board layout guidelines are recommended:

• Bypass capacitors should be used on power supplies and should be placed as close as possible to the VCCA, VCCB pin, and GND pin.

• Short trace lengths should be used to avoid excessive loading.

• PCB signal trace-lengths must be kept short enough so that the round-trip delay of any reflection is less than the one-shot duration, approximately 30 ns, ensuring that any reflection encounters low impedance at the source driver.