SCES861F June   2015  – November 2024 TXS0108E-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: TA = –40°C to 125°C
    6. 5.6  Timing Requirements: VCCA = 1.5V ± 0.1 V
    7. 5.7  Timing Requirements: VCCA = 1.8V ± 0.15V
    8. 5.8  Timing Requirements: VCCA = 2.5V ± 0.2V
    9. 5.9  Timing Requirements: VCCA = 3.3V ± 0.3V
    10. 5.10 Switching Characteristics: VCCA = 1.5V ± 0.1V
    11. 5.11 Switching Characteristics: VCCA = 1.8V ± 0.15V
    12. 5.12 Switching Characteristics: VCCA = 2.5V ± 0.2V
    13. 5.13 Switching Characteristics: VCCA = 3.3V ± 0.3V
    14. 5.14 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Load Circuits
    2. 6.2 Voltage Waveforms
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Architecture
      2. 7.3.2 Input Driver Requirements
      3. 7.3.3 Output Load Considerations
      4. 7.3.4 Enable and Disable
      5. 7.3.5 Pull-up or Pull-down Resistors on I/O Lines
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1.      Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RKS|20
  • PW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4.1 Layout Guidelines

For device reliability, following common printed-circuit board layout guidelines is recommended.

  • Bypass capacitors should be used on power supplies. Place the capacitors as close as possible to the VCCA, VCCB, and GND pin.
  • Short trace lengths should be used to avoid excessive loading.
  • PCB signal trace-lengths must be kept short enough so that the round-trip delay of any reflection is less than the one shot duration, approximately 30ns, causing any reflection to encounter low impedance at the source driver.