SCES861F June   2015  – November 2024 TXS0108E-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: TA = –40°C to 125°C
    6. 5.6  Timing Requirements: VCCA = 1.5V ± 0.1 V
    7. 5.7  Timing Requirements: VCCA = 1.8V ± 0.15V
    8. 5.8  Timing Requirements: VCCA = 2.5V ± 0.2V
    9. 5.9  Timing Requirements: VCCA = 3.3V ± 0.3V
    10. 5.10 Switching Characteristics: VCCA = 1.5V ± 0.1V
    11. 5.11 Switching Characteristics: VCCA = 1.8V ± 0.15V
    12. 5.12 Switching Characteristics: VCCA = 2.5V ± 0.2V
    13. 5.13 Switching Characteristics: VCCA = 3.3V ± 0.3V
    14. 5.14 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Load Circuits
    2. 6.2 Voltage Waveforms
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Architecture
      2. 7.3.2 Input Driver Requirements
      3. 7.3.3 Output Load Considerations
      4. 7.3.4 Enable and Disable
      5. 7.3.5 Pull-up or Pull-down Resistors on I/O Lines
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1.      Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RKS|20
  • PW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC (1)TXS0108E-Q1UNIT
PW (TSSOP)RKS (VQFN)
20 PINS20 PINS
RθJAJunction-to-ambient thermal resistance88.954.4°C/W
RθJC(top)Junction-to-case (top) thermal resistance32.954.2
RθJBJunction-to-board thermal resistance50.927.8
ψJTJunction-to-top characterization parameter1.42.9
ψJBJunction-to-board characterization parameter50.527.7
RθJC(bot)Junction-to-case (bottom) thermal resistance—11.5
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.