SCES642L December   2007  – November 2024 TXS0108E

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: TA = –40°C to 85°C
    6. 5.6  Timing Requirements: VCCA = 1.5V ± 0.1 V
    7. 5.7  Timing Requirements: VCCA = 1.8V ± 0.15V
    8. 5.8  Timing Requirements: VCCA = 2.5V ± 0.2V
    9. 5.9  Timing Requirements: VCCA = 3.3V ± 0.3V
    10. 5.10 Switching Characteristics: VCCA = 1.5V ± 0.1V
    11. 5.11 Switching Characteristics: VCCA = 1.8V ± 0.15V
    12. 5.12 Switching Characteristics: VCCA = 2.5V ± 0.2V
    13. 5.13 Switching Characteristics: VCCA = 3.3V ± 0.3V
    14. 5.14 Operating Characteristics: VCCA = 1.5V to 3.3V, VCCB = 1.5V to 3.3V
    15. 5.15 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Load Circuits
    2. 6.2 Voltage Waveforms
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Architecture
      2. 7.3.2 Input Driver Requirements
      3. 7.3.3 Output Load Considerations
      4. 7.3.4 Enable and Disable
      5. 7.3.5 Pull-up or Pull-down Resistors on I/O Lines
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1.      Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

TXS0108E ZXY Package, 20 BUMP (Bottom View)Figure 4-1 ZXY Package, 20 BUMP (Bottom View)
TXS0108E NME Package, 20 BGA (Bottom View)Figure 4-2 NME Package, 20 BGA (Bottom View)
Pin Assignments for ZXY and NME Packages
1 2 3 4 5
D VCCB B2 B4 B6 B8
C B1 B3 B5 B7 GND
B A1 A3 A5 A7 OE
A VCCA A2 A4 A6 A8
TXS0108E PW or DGS Package, 20-Pin TSSOP or 20-Pin VSSOP (Top View), Figure 4-3 PW or DGS Package, 20-Pin TSSOP or 20-Pin VSSOP (Top View),
TXS0108E RGY Package, 20 Pins (Top View)
The exposed center pad, if used, must be connected as a secondary ground or left electrically open.
Figure 4-5 RGY Package, 20 Pins (Top View)
TXS0108E RKS Package, 20-Pin VQFN (Top View)Figure 4-4 RKS Package, 20-Pin VQFN (Top View)
Table 4-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME PW, RGY, DGS ZXY, NME
A1 1 B1 I/O Input/output 1. Referenced to VCCA
A2 3 A2 I/O Input/output 2. Referenced to VCCA
A3 4 B2 I/O Input/output 3. Referenced to VCCA
A4 5 A3 I/O Input/output 4. Referenced to VCCA
A5 6 B3 I/O Input/output 5. Referenced to VCCA
A6 7 A4 I/O Input/output 6. Referenced to VCCA
A7 8 B4 I/O Input/output 7. Referenced to VCCA
A8 9 A5 I/O Input/output 8. Referenced to VCCA
B1 20 C 1 I/O Input/output 1. Referenced to VCCB
B2 18 D2 I/O Input/output 2. Referenced to VCCB
B3 17 C2 I/O Input/output 3. Referenced to VCCB
B4 16 D3 I/O Input/output 4. Referenced to VCCB
B5 15 C3 I/O Input/output 5. Referenced to VCCB
B6 14 D4 I/O Input/output 6. Referenced to VCCB
B7 13 C4 I/O Input/output 7. Referenced to VCCB
B8 12 D5 I/O Input/output 8. Referenced to VCCB
GND 11 C5 — Ground
OE 10 B5 I Tri-state output-mode enable. Pull OE low to place all outputs in 3-state mode. Referenced to VCCA.
VCCA 2 A1 P A-port supply voltage. 1.4V ≤ VCCA ≤ 3.6V, VCCA ≤ VCCB.
VCCB 19 D1 P B-port supply voltage. 1.65V ≤ VCCB ≤ 5.5V.
Thermal Pad — For the RGY package, the exposed center thermal pad must be either be connected to Ground or left electrically opened.
(1) I = input, O = output, I/O = input and output, P = power