SCES642L December   2007  – November 2024 TXS0108E

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: TA = –40°C to 85°C
    6. 5.6  Timing Requirements: VCCA = 1.5V ± 0.1 V
    7. 5.7  Timing Requirements: VCCA = 1.8V ± 0.15V
    8. 5.8  Timing Requirements: VCCA = 2.5V ± 0.2V
    9. 5.9  Timing Requirements: VCCA = 3.3V ± 0.3V
    10. 5.10 Switching Characteristics: VCCA = 1.5V ± 0.1V
    11. 5.11 Switching Characteristics: VCCA = 1.8V ± 0.15V
    12. 5.12 Switching Characteristics: VCCA = 2.5V ± 0.2V
    13. 5.13 Switching Characteristics: VCCA = 3.3V ± 0.3V
    14. 5.14 Operating Characteristics: VCCA = 1.5V to 3.3V, VCCB = 1.5V to 3.3V
    15. 5.15 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Load Circuits
    2. 6.2 Voltage Waveforms
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Architecture
      2. 7.3.2 Input Driver Requirements
      3. 7.3.3 Output Load Considerations
      4. 7.3.4 Enable and Disable
      5. 7.3.5 Pull-up or Pull-down Resistors on I/O Lines
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1.      Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC (1) TXS0108E UNIT
PW (TSSOP) RGY (VQFN) DGS (UFBGA) RKS (VSSOP) NME (NFBGA)
20 PINS 20 PINS 20 PINS 20 PINS 20 PINS
RθJA Junction-to-ambient thermal resistance 88.9 46.9 96.0 54.4 131.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 32.9 46.4 38.7 54.2 56.5 °C/W
RθJB Junction-to-board thermal resistance 50.9 24.9 53.0 27.8 83.2 °C/W
ψJT Junction-to-top characterization parameter 1.4 2.3 2.1 2.9 1.5 °C/W
ψJB Junction-to-board characterization parameter 50.5 24.8 52.6 27.7 82.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — 11.7 — 11.5 — °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.