SCES833B November   2011  – April 2016 TXS0206A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements—VCCA = 1.2 V ± 0.1 V
    7. 6.7  Timing Requirements—VCCA = 1.8 V ± 0.15 V
    8. 6.8  Timing Requirements—VCCA = 3.3 V ± 0.3 V
    9. 6.9  Switching Characteristics—VCCA = 1.2 V ± 0.1 V
    10. 6.10 Switching Characteristics—VCCA = 1.8 V ± 0.15 V
    11. 6.11 Switching Characteristics—VCCA = 3.3 V ± 0.3 V
    12. 6.12 Operating Characteristics —VCCA = 1.2 V
    13. 6.13 Operating Characteristics —VCCA = 1.8 V
    14. 6.14 Operating Characteristics — VCCA = 3.3 V
    15. 6.15 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Architecture
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 External Pulldown Resistors
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Layout

11.1 Layout Guidelines

To ensure reliability of the device, TI recommends following common printed-circuit board layout guidelines.

  • Bypass capacitors should be used on power supplies.
  • Short trace lengths should be used to avoid excessive loading
  • PCB signal trace-lengths must be kept short enough so that the round-trip delay of any reflection is less than the one shot duration, approximately 30 ns, ensuring that any reflection encounters low impedance at the source driver
  • With very heavy capacitive loads, the one-shot can time-out before the signal is driven fully to the positive rail, so it is recommended that this lumped-load capacitance be considered and kept below 50 pF to avoid O.S. retriggering, bus contention, output signal oscillations, or other adverse system-level affects.

11.2 Layout Example

TXS0206A TXS0206A_Layout_Top_Layer.gif Figure 10. TXS0206A Example Layout (Top Layer)
TXS0206A TXS0206A_Layout_Bottom_Layer.gif Figure 11. TXS0206A Example Layout (Bottom Layer)