SCES930B April   2021  – March 2022 TXU0104-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Related Products
  6. 6 Pin Configuration and Functions—TXU0104-Q1
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Switching Characteristics: Tsk, TMAX
    7. 7.7  Switching Characteristics, VCCA = 1.2 ± 0.1 V
    8. 7.8  Switching Characteristics, VCCA = 1.5 ± 0.1 V
    9. 7.9  Switching Characteristics, VCCA = 1.8 ± 0.15 V
    10. 7.10 Switching Characteristics, VCCA = 2.5 ± 0.2 V
    11. 7.11 Switching Characteristics, VCCA = 3.3 ± 0.3 V
    12. 7.12 Switching Characteristics, VCCA = 5.0 ± 0.5 V
    13. 7.13 Operating Characteristics
    14. 7.14 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Load Circuit and Voltage Waveforms
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  CMOS Schmitt-Trigger Inputs with Integrated Pulldowns
        1. 9.3.1.1 Inputs with Integrated Static Pull-Down Resistors
      2. 9.3.2  Control Logic (OE) with VCC(MIN) Circuitry
      3. 9.3.3  Balanced High-Drive CMOS Push-Pull Outputs
      4. 9.3.4  Partial Power Down (Ioff)
      5. 9.3.5  VCC Isolation and VCC Disconnect
      6. 9.3.6  Over-Voltage Tolerant Inputs
      7. 9.3.7  Glitch-Free Power Supply Sequencing
      8. 9.3.8  Negative Clamping Diodes
      9. 9.3.9  Fully Configurable Dual-Rail Design
      10. 9.3.10 Supports High-Speed Translation
      11. 9.3.11 Wettable Flanks
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Regulatory Requirements
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.3.11 Wettable Flanks

This device includes wettable flanks for at least one package. See the Features section on the front page of the data sheet for which packages include this feature.

Figure 9-3 Simplified Cutaway View of Wettable-Flank QFN Package and Standard QFN Package After Soldering

Wettable flanks help improve side wetting after soldering, which makes QFN packages easier to inspect with automatic optical inspection (AOI). A wettable flank can be dimpled or step-cut to provide additional surface area for solder adhesion which assists in reliably creating a side fillet as shown in Figure 9-3. Please see the mechanical drawing for additional details.