SCES930B April   2021  – March 2022 TXU0104-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Related Products
  6. 6 Pin Configuration and Functions—TXU0104-Q1
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Switching Characteristics: Tsk, TMAX
    7. 7.7  Switching Characteristics, VCCA = 1.2 ± 0.1 V
    8. 7.8  Switching Characteristics, VCCA = 1.5 ± 0.1 V
    9. 7.9  Switching Characteristics, VCCA = 1.8 ± 0.15 V
    10. 7.10 Switching Characteristics, VCCA = 2.5 ± 0.2 V
    11. 7.11 Switching Characteristics, VCCA = 3.3 ± 0.3 V
    12. 7.12 Switching Characteristics, VCCA = 5.0 ± 0.5 V
    13. 7.13 Operating Characteristics
    14. 7.14 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Load Circuit and Voltage Waveforms
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  CMOS Schmitt-Trigger Inputs with Integrated Pulldowns
        1. 9.3.1.1 Inputs with Integrated Static Pull-Down Resistors
      2. 9.3.2  Control Logic (OE) with VCC(MIN) Circuitry
      3. 9.3.3  Balanced High-Drive CMOS Push-Pull Outputs
      4. 9.3.4  Partial Power Down (Ioff)
      5. 9.3.5  VCC Isolation and VCC Disconnect
      6. 9.3.6  Over-Voltage Tolerant Inputs
      7. 9.3.7  Glitch-Free Power Supply Sequencing
      8. 9.3.8  Negative Clamping Diodes
      9. 9.3.9  Fully Configurable Dual-Rail Design
      10. 9.3.10 Supports High-Speed Translation
      11. 9.3.11 Wettable Flanks
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Regulatory Requirements
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions—TXU0104-Q1

GUID-2DF5428C-D0A8-430E-9824-6C30A3233E0B-low.gifFigure 6-1 PW Package,14-Pin TSSOPTransparent (Top View)
GUID-AECE1270-20AF-45F2-B6E0-E372FA002DCF-low.gifFigure 6-2 WBQA Package,14-Pin VQFNTransparent (Top View)
Table 6-1 TXU0104-Q1 Pin Functions
PINTYPE(1)DESCRIPTION
NAMEPW, WBQA
A12IInput A1. Referenced to VCCA.
A23IInput A2. Referenced to VCCA.
A34IInput A3. Referenced to VCCA.
A45IInput A4. Referenced to VCCA.
B1Y13OOutput B1. Referenced to VCCB.
B2Y12OOutput B2. Referenced to VCCB.
B3Y11OOutput B3. Referenced to VCCB.
B4Y10OOutput B4. Referenced to VCCB.
GND7—Ground
OE8IOutput Enable. Pull to GND to place all outputs in high-impedance mode. Pull to VCCA or VCCB to enable all outputs.
NC6, 9—No internal connection.
VCCA1—A-port supply voltage. 1.1 V ≤ VCCA ≤ 5.5 V
VCCB14—B-port supply voltage. 1.1 V ≤ VCCB ≤ 5.5 V
Thermal Pad—Thermal pad. May be left floating or grounded (recommended for best thermal and mechanical integrity).
(1) I = inpu, O = output