SCES949
August 2022
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions—TXU0202-Q1
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Switching Characteristics, VCCA = 1.2 ± 0.1 V
6.7
Switching Characteristics, VCCA = 1.5 ± 0.1 V
6.8
Switching Characteristics, VCCA = 1.8 ± 0.15 V
6.9
Switching Characteristics, VCCA = 2.5 ± 0.2 V
6.10
Switching Characteristics, VCCA = 3.3 ± 0.3 V
6.11
Switching Characteristics, VCCA = 5.0 ± 0.5 V
6.12
Operating Characteristics
6.13
Typical Characteristics
7
Parameter Measurement Information
7.1
Load Circuit and Voltage Waveforms
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
CMOS Schmitt-Trigger Inputs with Integrated Pulldowns
8.3.1.1
Inputs with Integrated Static Pull-Down Resistors
8.3.2
Control Logic (OE) with VCC(MIN) Circuitry
8.3.3
Balanced High-Drive CMOS Push-Pull Outputs
8.3.4
VCC Isolation and VCC Disconnect
8.3.5
Over-Voltage Tolerant Inputs
8.3.6
Glitch-Free Power Supply Sequencing
8.3.7
Negative Clamping Diodes
8.3.8
Fully Configurable Dual-Rail Design
8.3.9
Supports High-Speed Translation
8.4
Device Functional Modes
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.3
Application Curve
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Device Support
12.1.1
Regulatory Requirements
12.2
Documentation Support
12.2.1
Related Documentation
12.3
Receiving Notification of Documentation Updates
12.4
Support Resources
12.5
Trademarks
12.6
Electrostatic Discharge Caution
12.7
Glossary
13
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DTT|8
MPSS150A
DCU|8
MPDS050E
Thermal pad, mechanical data (Package|Pins)
Orderable Information
sces949_oa
sces949_pm
4
Revision History
DATE
REVISION
NOTES
August 2022
*
Initial Release