SCES942A November   2021  – March 2022 TXU0202

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Related Products
  6. 6 Pin Configuration and Functions—TXU0202
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Switching Characteristics, VCCA = 1.2 ± 0.1 V
    7. 7.7  Switching Characteristics, VCCA = 1.5 ± 0.1 V
    8. 7.8  Switching Characteristics, VCCA = 1.8 ± 0.15 V
    9. 7.9  Switching Characteristics, VCCA = 2.5 ± 0.2 V
    10. 7.10 Switching Characteristics, VCCA = 3.3 ± 0.3 V
    11. 7.11 Switching Characteristics, VCCA = 5.0 ± 0.5 V
    12. 7.12 Operating Characteristics
    13. 7.13 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Load Circuit and Voltage Waveforms
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 CMOS Schmitt-Trigger Inputs with Integrated Pulldowns
        1. 9.3.1.1 Inputs with Integrated Static Pull-Down Resistors
      2. 9.3.2 Control Logic (OE) with VCC(MIN) Circuitry
      3. 9.3.3 Balanced High-Drive CMOS Push-Pull Outputs
      4. 9.3.4 VCC Isolation and VCC Disconnect
      5. 9.3.5 Over-Voltage Tolerant Inputs
      6. 9.3.6 Glitch-Free Power Supply Sequencing
      7. 9.3.7 Negative Clamping Diodes
      8. 9.3.8 Fully Configurable Dual-Rail Design
      9. 9.3.9 Supports High-Speed Translation
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Regulatory Requirements
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) TXU0202 UNIT
DCU (VSSOP) DTT (SON) DTM (X2SON)
8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 257.0 TBD 253.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 106.9 TBD 157.5 °C/W
RθJB Junction-to-board thermal resistance 168.3 TBD 157.8 °C/W
YJT Junction-to-top characterization parameter 47.2 TBD 15.6 °C/W
YJB Junction-to-board characterization parameter 167.3 TBD 157.6 °C/W
RθJC(bottom) Junction-to-case (bottom) thermal resistance N/A TBD N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.