SCES956B August   2023  – April 2024 TXV0106-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, VCCA = 1.2 ± 0.06 V
    7. 5.7  Switching Characteristics, VCCA = 1.8 ± 0.15 V
    8. 5.8  Switching Characteristics, VCCA = 2.5 ± 0.2 V
    9. 5.9  Switching Characteristics, VCCA = 3.3 ± 0.3 V
    10. 5.10 Typical Characteristics
  7. Parameter Measurement Information
    1. 6.1 Load Circuit and Voltage Waveforms
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced High-Drive CMOS Push-Pull Outputs
      2. 7.3.2 Partial Power Down (Ioff)
      3. 7.3.3 VCC Isolation and VCC Disconnect (Ioff-float)
      4. 7.3.4 Over-Voltage Tolerant Inputs
      5. 7.3.5 Negative Clamping Diodes
      6. 7.3.6 Fully Configurable Dual-Rail Design
      7. 7.3.7 Supports High-Speed Translation
      8. 7.3.8 Wettable Flanks
      9. 7.3.9 Integrated Damping Resistor and Impedance Matching
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 System Examples
      1. 8.3.1 Solving Power Sequencing Challenges with the TXV0106-Q1
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • BQB|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)(1) (2)
PARAMETER TEST CONDITIONS VCCA VCCB Operating free-air temperature (TA) UNIT
–40°C to 125°C
MIN TYP MAX
VIL Data Input_Negative threshold Data inputs, OE 1.14 V - 3.6 V 1.14 V - 3.6 V 0.3× VCCA V
VIH Data Input_Positive threshold Data inputs, OE 1.14 V - 3.6 V 1.14 V - 3.6 V 0.7× VCCA V
VOH High-level output voltage (3)  IOH = –3 mA 1.14  V 1.14 V 0.9 V
IOH = –8 mA 1.65 V 1.65 V 1.1
IOH = –9 mA 2.3 V 2.3 V 1.8
IOH = –12 mA 3 V 3 V 2.4
VOL Low-level output voltage (4)  IOL = 3 mA 1.14 V 1.14 V 0.1 V
IOL = 8 mA 1.65 V 1.65 V 0.27
IOL = 9 mA 2.3 V 2.3 V 0.23
IOL = 12 mA 3 V 3 V 0.26
II Input leakage current Data Inputs
(Ax, Bx)
VI = VCCI or GND
1.14 V - 3.6 V 1.14 V - 3.6 V –1 1 µA
Ioff Partial power down current A Port or B Port
VI or VO = 0 V - 3.6 V
0 V 0 V - 3.6 V –5 3.6 µA
0 V - 3.6 V 0 V –5 3.6
IOZ Tri-state output current (5) A or B Port:
VI = VCCI or GND
VO = VCCO or GND
OE = VIH
3.6 V 3.6 V –5 5 µA
ICCA VCCA supply current VI = VCCI or GND
IO = 0
1.14 V - 3.6 V 1.14 V - 3.6 V 14 µA
3.6 V 0 V 11
0 V 3.6 V -1
ICCB VCCB supply current VI = VCCI or GND
IO = 0
1.14 V - 3.6 V 1.14 V - 3.6 V 14 µA
3.6 V 0 V –1
0 V 3.6 V 11
ICCA + ICCB Combined supply current VI = VCCI or GND
IO = 0
1.14 V - 3.6 V 1.14 V - 3.6 V 22 µA
Ci Control Input Capacitance VI = 3.3 V or GND 3.3 V 3.3 V 3.9 pF
Cio Data I/O Capacitance OE = VCCA, VO = 1.65V DC +1 MHz -16 dBm sine wave 3.3 V 3.3 V 2.7 pF
VCCI is the VCC associated with the input port.
VCCO is the VCC associated with the output port.
Tested at VI = VIH.
Tested at VI = VIL.
For I/O ports, the parameter IOZ includes the input leakage current.