SCES957A December   2023  – April 2024 TXV0106

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, VCCA = 1.2 ± 0.06 V
    7. 5.7  Switching Characteristics, VCCA = 1.8 ± 0.15 V
    8. 5.8  Switching Characteristics, VCCA = 2.5 ± 0.2 V
    9. 5.9  Switching Characteristics, VCCA = 3.3 ± 0.3 V
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Load Circuit and Voltage Waveforms
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced High-Drive CMOS Push-Pull Outputs
      2. 7.3.2 Partial Power Down (Ioff)
      3. 7.3.3 VCC Isolation and VCC Disconnect (Ioff-float)
      4. 7.3.4 Over-Voltage Tolerant Inputs
      5. 7.3.5 Negative Clamping Diodes
      6. 7.3.6 Fully Configurable Dual-Rail Design
      7. 7.3.7 Supports High-Speed Translation
      8. 7.3.8 Integrated Damping Resistor and Impedance Matching
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 System Examples
      1. 8.3.1 Solving Power Sequencing Challenges with the TXV0106
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • BQB|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Configurable design allows each port to operate with a power supply range from 1.2 V to 3.6 V

  • Supports up to 500Mbps for 1.65 V to 3.6 V
  • Meets RGMII 2.0 timing specifications:
    • < 750 ps rise and fall time
    • < ± 5 % duty cycle distortion
    • < ± 400 ps channel to channel skew
    • Up to 250Mbps/channel
  • Integrated 10 Ω damping output resistor to minimize signal reflections
  • High drive strength (up to 12 mA at 3.6 V)
  • Fully configurable symmetric dual-rail design
  • Optimal signal integrity performance with 390ps peak-to-peak jitter for 1.8 V to 3.3 V
  • Features VCC isolation and VCC disconnect
  • Ioff supports partial-power-down mode operation
  • Latch-up performance exceeds 100 mA per JESD 78, Class II
  • ESD protection exceeds JESD 22:
    • 2000-V Human-Body Model
    • 1000-V Charged-Device Model
  • Low power consumption:
    • 10-µA maximum (25°C)
    • 20-µA maximum (–40°C to 125°C)
  • Operating temperature from –40°C to +125°C