SLVS010X january 1976 – june 2023 UA78L
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | UA78L00 | UNIT | |||
---|---|---|---|---|---|
D (SOIC) | LP (TO-92) | PK (SOT-89) | |||
8 PINS | 3 PINS | 3 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 115 | 143.6 | 54.7 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 60.3 | 74.4 | 88.1 | °C/W |
RθJB | Junction-to-board thermal resistance | 55.6 | — | 9.6 | °C/W |
ψJT | Junction-to-top characterization parameter | 16.2 | 24.2 | 6.2 | °C/W |
ψJB | Junction-to-board characterization parameter | 55 | 120.9 | 9.7 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | — | 7.7 | °C/W |