SLVS059U June   1976  – May 2024

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: UA78M33 (Both Legacy and New Chip)
    6. 5.6  Electrical Characteristics: UA78M05 (Both Legacy and New Chip)
    7. 5.7  Electrical Characteristics: UA78M06C (Legacy Chip Only)
    8. 5.8  Electrical Characteristics: UA78M08C (Legacy Chip Only)
    9. 5.9  Electrical Characteristics: UA78M09 (Legacy Chip Only)
    10. 5.10 Electrical Characteristics: UA78M10 (Legacy Chip Only)
    11. 5.11 Electrical Characteristics: UA78M12 (Legacy Chip Only)
    12. 5.12 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Current Limit
      2. 6.3.2 Dropout Voltage (VDO)
      3. 6.3.3 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input and Output Capacitor Requirements
        2. 7.2.2.2 Power Dissipation (PD)
        3. 7.2.2.3 Estimating Junction Temperature
        4. 7.2.2.4 External Capacitor Requirements
        5. 7.2.2.5 Overload Recovery
        6. 7.2.2.6 Reverse Current
        7. 7.2.2.7 Polarity Reversal Protection
      3. 7.2.3 Application Curves
    3. 7.3 System Examples
      1. 7.3.1 Positive Regulator in Negative Configuration
      2. 7.3.2 Current Limiter Circuit
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Evaluation Module
      2. 8.1.2 Device Nomenclature
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • KVU|3
  • DCY|4
  • KCS|3
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision T (January 2015) to Revision U (May 2024)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Changed entire document to align with current family formatGo
  • Added M3 devices to documentGo
  • Changed pin names from IN, GND, and OUT to INPUT, COMMON, and OUTPUT throughout document for consistencyGo

Changes from Revision S (May 2013) to Revision T (January 2015)

  • Added Applications, Device Information table, Pin Functions table, ESD Ratings table, Thermal Information table, Typical Characteristics, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go