SLLS112D April   1994  – March 2024

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Dissipation Rating Table
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Device Functional Modes
  9. 8 Device and Documentation Support
    1. 8.1 Support Resources
    2. 8.2 Trademarks
    3. 8.3 Electrostatic Discharge Caution
    4. 8.4 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • P|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)D

(SOIC)

P

(PDIP)

UNIT
8-Pins
R θJAJunction-to-ambient thermal resistance 116.784.3°C/W
RθJC(top)Junction-to-case (top) thermal resistance56.365.4°C/W
R θJBJunction-to-board thermal resistance 63.462.1°C/W
ψ JTJunction-to-top characterization parameter 8.831.3°C/W
ψ JBJunction-to-board characterization parameter 62.660.4°C/W
R θJC(bot)Junction-to-case (bottom) thermal resistance N/AN/A°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.