SLUSAG0A March   2011  – March 2016 UC1707-SP

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Switching Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Simplified Internal Circuitry
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Shutdown Circuit Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Community Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VIN Supply voltage 40 V
VC Collector supply voltage 40 V
Digital inputs(2) 5.5 V
Output current (each output, source or sink) steady-state ±500 mA
Peak transient ±1 A
Capacitive discharge energy 15 mJ
Analog stop inputs VIN
TJ Operating virtual-junction temperature 150 °C
Power dissipation at Tcase = 25°C(2) J package 13 W
W package 15 W
FK package 13 W
Lead temperature (soldering, 10 s) 300 °C
Operating temperature –55 125 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the four ground pins which must be connected together. All currents are positive into, negative out of the specified terminal. Digital drive can exceed 5.5 V if input current is limited to 10 mA. Consult packaging section of datasheet for thermal limitations and considerations of package.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VIN Supply voltage 5 12 38 V
VC Supply voltage 5 12 38 V

6.4 Thermal Information

THERMAL METRIC(1) UC1707-SP UNIT
J (CDIP) FK (LCCC) W (CFP)
16 PINS 20 PINS 16 PINS
RθJC(top) Junction-to-case (top) thermal resistance 36 31.8 53.6 °C/W
RθJB Junction-to-board thermal resistance 55.2 31.3 105 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 9.5 2.8 4.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

Unless otherwise stated, these specifications apply for TA = –55°C to 125°C; VIN = VC = 20 V. TA = TJ.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN Supply current VIN = 40 V 12 15 mA
VC Supply current VC = 40 V, outputs low 5.2 7.5 mA
VC Leakage current VIN = 0, VC - 30 V, no load 0.05 0.1 mA
Digital input low level 0.8 V
Digital input high level 2.2 V
Input current VI = 0 –0.06 –1.0 mA
Input leakage VI = 5 V 0.05 0.1 mA
VC – VO Output high sat IO = –50 mA 2.0 V
IO = –500 mA 2.5 V
VO Output low sat IO = –50 mA 0.4 V
IO = –500 mA 2.5 V
Analog threshold VCM = 0 to 15 V 8761901 100 130 150 mV
8761903 90 130 150 mV
Input bias current VCM = 0 –10 –20 μA
Thermal shutdown 155 °C
Shutdown threshold Pin 7 input 0.4 1.0 2.2 V
Latch disable threshold Pin 3 input 0.8 1.2 2.2 V

6.6 Typical Switching Characteristics

VIN = VC = 20 V, TA = 25°C. Delays measured to 10% output change.
PARAMETER TEST CONDITIONS OUTPUT CL = UNIT
FROM INV. INPUT TO OUTPUT open 1.0 2.2 nF
Rise time delay 40 50 60 ns
10% to 90% rise 25 40 50 ns
Fall time delay 30 40 50 ns
90% to 10% fall 25 40 50 ns
FROM N.I. INPUT TO OUTPUT
Rise time delay 30 40 50 ns
10% to 90% rise 25 40 50 ns
Fall time delay 45 55 65 ns
90% to 10% fall 25 40 50 ns
VC Cross-conduction current spike duration Output rise 25 ns
Output fall 0 ns
Analog shutdown delay Stop non-Inv. = 0 V 180 ns
Stop Inv. = 0 to 0.5 V 180 ns
Digital shutdown delay 2 V input on Pin 7 50 ns