4 Revision History
Changes from B Revision (October 2015) to C Revision
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Added new RHA featuresGo
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Added new RHA packages to Device Information tableGo
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Added new HKT pin diagram to Pin Configuration and Functions sectionGo
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Changed TJ MIN from –40°C : to –55°CGo
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Added Receiving Notification of Documentation Updates section to Device and Documentation Support sectionGo
Changes from A Revision (January 2009) to B Revision
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Added ESD Ratings table, Thermal Information table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo