4 Revision History
Changes from F Revision (August 2010) to G Revision
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Added Device Information table, Pin Configuration and Functions section, Specifications section, ESD Ratings table, Recommended Operating Conditions table, Switching Characteristics table, Typical Characteristics section, Detailed Description section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
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Deleted Ordering Information table; see POA at the end of the data sheetGo
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Moved Delay to output time parameters from Electrical Characteristics to Switching CharacteristicsGo
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Moved rise and fall time parameters from Electrical Characteristics to Switching CharacteristicsGo
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Deleted Lead temperature soldering rating in the Absolute Maximum Ratings tableGo
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Added Thermal Information tableGo
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Changed RθJA values for DW (SOIC) package From: 50°C/W to 100°C/W To: 70.5°C/W and for N (PDIP) package From: 90°C/W To: 44.5°C/WGo
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Changed RθJC(top) values for DW (SOIC) package From: 27°C/W To: 31.8°C/W and for N (PDIP) package From: 45°C/W To: 34.3°C/WGo