SLUS557G March   2003  – December 2016 UC28023 , UC28025

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. Parameter Measurement Information
    1. 7.1 Control Methods and Test Circuits
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Error Amplifier
      2. 8.3.2 Synchronization
      3. 8.3.3 Constant Volt-Second Clamp Circuit
      4. 8.3.4 Outputs
      5. 8.3.5 Open-Loop Laboratory Test Fixture
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Timing Resistor and Capacitor Selection
        2. 9.2.2.2 Turns Ratio Selection
        3. 9.2.2.3 Inductor Selection
        4. 9.2.2.4 Rectifier Diode Selection
        5. 9.2.2.5 Snubber Components Selection
        6. 9.2.2.6 VCC and VC Capacitor Selection
        7. 9.2.2.7 Output Capacitor Selection
        8. 9.2.2.8 Input Capacitor Selection
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from F Revision (August 2010) to G Revision

  • Added Device Information table, Pin Configuration and Functions section, Specifications section, ESD Ratings table, Recommended Operating Conditions table, Switching Characteristics table, Typical Characteristics section, Detailed Description section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Deleted Ordering Information table; see POA at the end of the data sheetGo
  • Moved Delay to output time parameters from Electrical Characteristics to Switching CharacteristicsGo
  • Moved rise and fall time parameters from Electrical Characteristics to Switching CharacteristicsGo
  • Deleted Lead temperature soldering rating in the Absolute Maximum Ratings tableGo
  • Added Thermal Information tableGo
  • Changed RθJA values for DW (SOIC) package From: 50°C/W to 100°C/W To: 70.5°C/W and for N (PDIP) package From: 90°C/W To: 44.5°C/WGo
  • Changed RθJC(top) values for DW (SOIC) package From: 27°C/W To: 31.8°C/W and for N (PDIP) package From: 45°C/W To: 34.3°C/WGo