SLUS223H April   1997  – October 2024 UC1842 , UC1843 , UC1844 , UC1845 , UC2842 , UC2843 , UC2844 , UC2845 , UC3842 , UC3843 , UC3844 , UC3845

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1  Detailed Pin Description
        1. 7.3.1.1 COMP
        2. 7.3.1.2 VFB
        3. 7.3.1.3 ISENSE
        4. 7.3.1.4 RT/CT
        5. 7.3.1.5 GROUND
        6. 7.3.1.6 OUTPUT
        7. 7.3.1.7 VCC
        8. 7.3.1.8 VREF
      2. 7.3.2  Pulse-by-Pulse Current Limiting
      3. 7.3.3  Current-Sense
      4. 7.3.4  Error Amplifier With Low Output Resistance
      5. 7.3.5  Undervoltage Lockout
      6. 7.3.6  Oscillator
      7. 7.3.7  Synchronization
      8. 7.3.8  Shutdown Technique
      9. 7.3.9  Slope Compensation
      10. 7.3.10 Soft Start
      11. 7.3.11 Voltage Mode
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 UVLO Mode
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Open-Loop Test Fixture
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Input Bulk Capacitor and Minimum Bulk Voltage
        2. 8.2.2.2  Transformer Turns Ratio and Maximum Duty Cycle
        3. 8.2.2.3  Transformer Inductance and Peak Currents
        4. 8.2.2.4  Output Capacitor
        5. 8.2.2.5  Current Sensing Network
        6. 8.2.2.6  Gate Drive Resistor
        7. 8.2.2.7  VREF Capacitor
        8. 8.2.2.8  RT/CT
        9. 8.2.2.9  Start-Up Circuit
        10. 8.2.2.10 Voltage Feedback Compensation
          1. 8.2.2.10.1 Power Stage Poles and Zeroes
          2. 8.2.2.10.2 Slope Compensation
          3. 8.2.2.10.3 Open-Loop Gain
          4. 8.2.2.10.4 Compensation Loop
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Feedback Traces
        2. 8.4.1.2 Bypass Capacitors
        3. 8.4.1.3 Compensation Components
        4. 8.4.1.4 Traces and Ground Planes
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

OUTPUT

The high-current bipolar totem-pole output of the UCx84x devices sinks or sources up to 1-A peak of current. The OUTPUT pin can directly drive a MOSFET. The OUTPUT of the UCx842 and UCx843 devices switches at the same frequency as the oscillator and can operate near 100% duty cycle. In the UCx844 and UCx845 devices, the switching frequency of OUTPUT is one-half that of the oscillator due to an internal T flipflop. This limits the maximum duty cycle in the UCx844 and UCx845 to < 50%. Schottky diodes can be necessary on the OUTPUT pin to prevent overshoot and undershoot due to high impedance to the supply rail and to ground, respectively. A bleeder resistor, placed between the gate and the source of the MOSFET, can be used to prevent activating the power switch with extraneous leakage currents during undervoltage lockout. An external clamp circuit can be necessary to prevent overvoltage stress on the MOSFET gate when VCC exceeds the gate voltage rating.