SLUS224H September   1994  – October 2024 UC1842A , UC1843A , UC1844A , UC1845A , UC2842A , UC2843A , UC2844A , UC2845A , UC3842A , UC3843A , UC3844A , UC3845A

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Pulse-by-Pulse Current Limiting
      2. 6.3.2 Current Sense Circuit
      3. 6.3.3 Error Amplifier Configuration
      4. 6.3.4 Undervoltage Lockout
      5. 6.3.5 Oscillator
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Undervoltage Lockout (UVLO) Start-Up
      3. 6.4.3 UVLO Turnoff Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Custom Design With WEBENCH® Tools
        2. 7.2.2.2 UC2842A Design Procedure
      3. 7.2.3 Application Curves
  9. 8 Power Supply Recommendations
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
        1. 10.1.1.1 Custom Design With WEBENCH® Tools
      2. 10.1.2 Device Nomenclature
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Related Links
    4. 10.4 Receiving Notification of Documentation Updates
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.1 Layout Guidelines

  • Star grounding techniques must be used.
  • Current loops must be kept as short and narrow as possible.
  • The IC ground and power ground must meet at the return for the input bulk capacitor. Verify that high frequency and high current from the power stage does not go through the signal ground paths.
  • A high-frequency bypass capacitor (CVCC1) must be placed across VCC and GND pins as close as possible to the pins.
  • Resistor RS2 and capacitor CF form a low-pass filter for the current sense signal. CF must be as close to CS and GND pins as possible.
  • Capacitor CVREF must be as close to VREF and GND pins as possible.
  • Figure 9-1 shows the SMD components arranged for wave-solder on a single-layer board. If multiple layers are used, some components can be rearranged for easier interconnection and reduced current-loop areas. If the solder process allows, placing the SMD components in perpendicular orientations can improve interconnections and loop areas.