SNVSB38D September   2019  – January 2021 UCC12050

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications and Uses
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Switching Characteristics
    11. 6.11 Insulation Characteristics Curves
    12. 6.12 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable and Disable
      2. 7.3.2 UVLO, Power-Up, and Power-Down Behavior
      3. 7.3.3 VISO Load Recommended Operating Area
      4. 7.3.4 Thermal Shutdown
      5. 7.3.5 External Clocking and Synchronization
      6. 7.3.6 VISO Output Voltage Selection
      7. 7.3.7 Electromagnetic Compatibility (EMC) Considerations
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 VISO Output Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical and Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.4 Thermal Shutdown

Thermal protection is also integrated to help prevent the device from getting damaged during overload and short-circuit conditions on the isolated output. Under these conditions, the device temperature starts to increase. When the silicon junction temperature Tj sensed at the primary side die goes above the threshold TSDTHR(typical 165°C), thermal shutdown activates and the primary controller turns off which removes the energy supplied to the VISO load, which causes the device to cool off. When the junction temperature drops approximately 27°C (TSDHYST) from the shutdown point, the device starts to function normally. If an overload or output short-circuit condition prevails, this protection cycle is repeated. Make sure the design prevents the device junction temperatures from reaching such high values.