SLUSF11C February   2023  – March 2024 UCC14341-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Insulation Specifications
    6. 6.6  Electrical Characteristics
    7. 6.7  Safety Limiting Values
    8. 6.8  Safety-Related Certifications
    9. 6.9  Insulation Characteristics
    10. 6.10 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Stage Operation
        1. 7.3.1.1 VDD-VEE Voltage Regulation
        2. 7.3.1.2 COM-VEE Voltage Regulation
        3. 7.3.1.3 Power Handling Capability
      2. 7.3.2 Output Voltage Soft Start
      3. 7.3.3 ENA and PG
      4. 7.3.4 Protection Functions
        1. 7.3.4.1 Input Undervoltage Lockout
        2. 7.3.4.2 Input Overvoltage Lockout
        3. 7.3.4.3 Output Undervoltage Protection
        4. 7.3.4.4 Output Overvoltage Protection
        5. 7.3.4.5 Overpower Protection
        6. 7.3.4.6 Over-Temperature Protection
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Capacitor Selection
        2. 8.2.2.2 Single RLIM Resistor Selection
        3. 8.2.2.3 RDR Circuit Component Selection
        4. 8.2.2.4 Feedback Resistors Selection
    3. 8.3 System Examples
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
  13. 12Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
Parameters PIN MIN TYP MAX UNIT
VIN to GNDP –0.3 32 V
ENA, PG to GNDP –0.3 7 V
VDD, VEE, RLIM, FBVDD, FBVEE to VEE –0.3 32 V
POUT_VDD_MAX Total (VDD-VEE) output power at TA=25°C 2.5 W
IRLIM_MAX_RMS_SOURCE Max RLIM pin rms current sourcing from VDD to RLIM. (16% average run time over lifetime of 24,500 hr) 0.125 A
IRLIM_MAX_RMS_SINK Max RLIM pin rms current sinking from RLIM to VEE. (16% average run time over lifetime of 24,500 hr) 0.125 A
TJ Operating junction temperature range –40 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.