SLUSF13 august 2023 UCC15240-Q1
PRODUCTION DATA
THERMAL METRIC(1) | UNIT | ||
---|---|---|---|
DWN (SOIC) | |||
36 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 52.3 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 28.5 | °C/W |
RθJB | Junction-to-board thermal resistance | 25.9 | °C/W |
ΨJA | Junction-to-ambient characterization parameter | 29.5 | °C/W |
ΨJT | Junction-to-top characterization parameter | 16.6 | °C/W |
ΨJB | Junction-to-board characterization parameter | 25.6 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | – | °C/W |