SLUS157Q December   1999  – October 2019 UCC1895 , UCC2895 , UCC3895

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Application Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1  ADS (Adaptive Delay Set)
      2. 7.3.2  CS (Current Sense)
      3. 7.3.3  CT (Oscillator Timing Capacitor)
      4. 7.3.4  DELAB and DELCD (Delay Programming Between Complementary Outputs)
      5. 7.3.5  EAOUT, EAP, and EAN (Error Amplifier)
      6. 7.3.6  OUTA, OUTB, OUTC, and OUTD (Output MOSFET Drivers)
      7. 7.3.7  PGND (Power Ground)
      8. 7.3.8  RAMP (Inverting Input of the PWM Comparator)
      9. 7.3.9  REF (Voltage Reference)
      10. 7.3.10 RT (Oscillator Timing Resistor)
      11. 7.3.11 GND (Analog Ground)
      12. 7.3.12 SS/DISB (Soft Start/Disable)
      13. 7.3.13 SYNC (Oscillator Synchronization)
      14. 7.3.14 VDD (Chip Supply)
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 Programming DELAB, DELCD and the Adaptive Delay Set
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Power Loss Budget
        2. 8.2.2.2  Preliminary Transformer Calculations (T1)
        3. 8.2.2.3  QA, QB, QC, QD FET Selection
        4. 8.2.2.4  Selecting LS
        5. 8.2.2.5  Selecting Diodes DB and DC
        6. 8.2.2.6  Output Inductor Selection (LOUT)
        7. 8.2.2.7  Output Capacitance (COUT)
        8. 8.2.2.8  Select Rectifier Diodes
        9. 8.2.2.9  Input Capacitance (CIN)
        10. 8.2.2.10 Current Sense Network (CT, RCS, RR, DA)
          1. 8.2.2.10.1 Output Voltage Setpoint
          2. 8.2.2.10.2 Voltage Loop Compensation
          3. 8.2.2.10.3 Setting the Switching Frequency
          4. 8.2.2.10.4 Soft Start
          5. 8.2.2.10.5 Setting the Switching Delays
          6. 8.2.2.10.6 Setting the Slope Compensation
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
      2. 11.1.2 Related Links
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resource
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) UCC1895 UCC2895
UCC3895		 UCC2895
UCC3895		 UCC3895 UNIT
J
(CDIP)		 FK
(LCCC)		 DW
(SOIC)		 PW
(TSSOP)		 FN
(PLCC)		 N
(PDIP)
20 PINS 20 PINS 20 PINS 20 PINS 20 PINS 20 PINS
RθJA Junction-to-ambient thermal resistance N/A N/A 66.4 91.0 54.8 48.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 34.2 31.2 31.6 26.1 32.8 35.6 °C/W
RθJB Junction-to-board thermal resistance 48.9 30.9 34.1 42.2 19.0 29.6 °C/W
ψJT Junction-to-top characterization parameter N/A N/A 8.6 1.3 9.0 16.0 °C/W
ψJB Junction-to-board characterization parameter N/A N/A 33.7 41.6 18.7 29.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 8.9 3.3 N/A N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.