SLUSCX6B
February 2018 – February 2024
UCC21222
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Power Ratings
5.6
Insulation Specifications
5.7
Safety-Related Certifications
5.8
Safety-Limiting Values
5.9
Electrical Characteristics
5.10
Switching Characteristics
5.11
Thermal Derating Curves
5.12
Typical Characteristics
6
Parameter Measurement Information
6.1
Minimum Pulses
6.2
Propagation Delay and Pulse Width Distortion
6.3
Rising and Falling Time
6.4
Input and Disable Response Time
6.5
Programmable Dead Time
6.6
Power-Up UVLO Delay to OUTPUT
6.7
CMTI Testing
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
VDD, VCCI, and Undervoltage Lock Out (UVLO)
7.3.2
Input and Output Logic Table
7.3.3
Input Stage
7.3.4
Output Stage
7.3.5
Diode Structure in the UCC21222
7.4
Device Functional Modes
7.4.1
Disable Pin
7.4.2
Programmable Dead Time (DT) Pin
7.4.2.1
DT Pin Tied to VCCI or DT Pin Left Open
7.4.2.2
Connecting a Programming Resistor between DT and GND Pins
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Custom Design With WEBENCH® Tools
8.2.2.2
Designing INA/INB Input Filter
8.2.2.3
Select Dead Time Resistor and Capacitor
8.2.2.4
Select External Bootstrap Diode and its Series Resistor
8.2.2.5
Gate Driver Output Resistor
8.2.2.6
Estimating Gate Driver Power Loss
8.2.2.7
Estimating Junction Temperature
8.2.2.8
Selecting VCCI, VDDA/B Capacitor
8.2.2.8.1
Selecting a VCCI Capacitor
8.2.2.8.2
Selecting a VDDA (Bootstrap) Capacitor
8.2.2.8.3
Select a VDDB Capacitor
8.2.2.9
Application Circuits with Output Stage Negative Bias
8.2.3
Application Curves
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.1.1
Component Placement Considerations
10.1.2
Grounding Considerations
10.1.3
High-Voltage Considerations
10.1.4
Thermal Considerations
10.2
Layout Example
11
Device and Documentation Support
11.1
Device Support
11.1.1
Third-Party Products Disclaimer
11.1.2
Development Support
11.1.2.1
Custom Design With WEBENCH® Tools
11.2
Documentation Support
11.2.1
Related Documentation
11.3
Receiving Notification of Documentation Updates
11.4
Support Resources
11.5
Trademarks
11.6
Electrostatic Discharge Caution
11.7
Glossary
12
Revision History
13
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
D|16
MPDS178G
Thermal pad, mechanical data (Package|Pins)
Orderable Information
sluscx6b_oa
sluscx6b_pm
11
Device and Documentation Support