SLUSF70 May   2024 UCC21331

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety Limiting Values
    8. 5.8  Electrical Characteristics
    9. 5.9  Switching Characteristics
    10. 5.10 Insulation Characteristics Curves
    11. 5.11 Typical Characteristics
  7. Parameter Measurement Information
    1. 6.1 Propagation Delay and Pulse Width Distortion
    2. 6.2 Rising and Falling Time
    3. 6.3 Input and Disable Response Time
    4. 6.4 Programmable Dead Time
    5. 6.5 Power-up UVLO Delay to OUTPUT
    6. 6.6 CMTI Testing
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 VDD, VCCI, and Undervoltage Lock Out (UVLO)
      2. 7.3.2 Input and Output Logic Table
      3. 7.3.3 Input Stage
      4. 7.3.4 Output Stage
      5. 7.3.5 Diode Structure in the UCC21331
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable Pin
      2. 7.4.2 Programmable Dead-Time (DT) Pin
        1. 7.4.2.1 Tying the DT Pin to VCC
        2. 7.4.2.2 DT Pin Connected to a Programming Resistor Between DT and GND Pins
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Designing INA/INB Input Filter
        2. 8.2.2.2 Select External Bootstrap Diode and its Series Resistor
        3. 8.2.2.3 Gate Driver Output Resistor
        4. 8.2.2.4 Gate to Source Resistor Selection
        5. 8.2.2.5 Estimate Gate Driver Power Loss
        6. 8.2.2.6 Estimating Junction Temperature
        7. 8.2.2.7 Selecting VCCI, VDDA/B Capacitor
          1. 8.2.2.7.1 Selecting a VCCI Capacitor
          2. 8.2.2.7.2 Selecting a VDDA (Bootstrap) Capacitor
          3. 8.2.2.7.3 Select a VDDB Capacitor
        8. 8.2.2.8 Dead Time Setting Guidelines
        9. 8.2.2.9 Application Circuits with Output Stage Negative Bias
      3. 8.2.3 Application Curves
  10. Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Certifications
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Support Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Typical Characteristics

VDDA = VDDB= 15 V, VCCI = 3.3 V, TA = 25°C, No load unless otherwise noted.

UCC21331 Per
                        Channel Current Consumption (IVDDA/B) vs Frequency (No Load, VDD
                        = 15V or 25 V)
Figure 5-3 Per Channel Current Consumption (IVDDA/B) vs Frequency (No Load, VDD = 15V or 25 V)
UCC21331 Per
                        Channel Current Consumption (IVDDA/B) vs Frequency (10-nF Load,
                        VDD = 15 V or 25 V)
Figure 5-5 Per Channel Current Consumption (IVDDA/B) vs Frequency (10-nF Load, VDD = 15 V or 25 V)
UCC21331 Per
                        Channel (IVDDA/B) Quiescent Supply Current vs Temperature (No
                        Load, Input Low, No Switching)
Figure 5-7 Per Channel (IVDDA/B) Quiescent Supply Current vs Temperature (No Load, Input Low, No Switching)
UCC21331 Rising and Falling Times vs Load (VDD = 15V)
Figure 5-9 Rising and Falling Times vs Load (VDD = 15V)
UCC21331 Propagation Delay vs Temperature
Figure 5-11 Propagation Delay vs Temperature
UCC21331 Pulse
                        Width Distortion vs Temperature
Figure 5-13 Pulse Width Distortion vs Temperature
UCC21331 Propagation Delay Matching (tDM) vs Temperature
Figure 5-15 Propagation Delay Matching (tDM) vs Temperature
UCC21331 VDD
                            12-V UVLO Hysteresis vs Temperature
Figure 5-17 VDD 12-V UVLO Hysteresis vs Temperature
UCC21331 IN/EN
                        Low Threshold
Figure 5-19 IN/EN Low Threshold
UCC21331 Dead
                        Time vs Temperature (with RDT = 20 kΩ and 100 kΩ)
Figure 5-21 Dead Time vs Temperature (with RDT = 20 kΩ and 100 kΩ)
UCC21331 Typical Output Waveforms
Figure 5-23 Typical Output Waveforms
UCC21331 Per
                        Channel Current Consumption (IVDDA/B) vs Frequency (1-nF Load,
                        VDD = 15V or 25 V)
Figure 5-4 Per Channel Current Consumption (IVDDA/B) vs Frequency (1-nF Load, VDD = 15V or 25 V)
UCC21331 Per
                        Channel (IVDDA/B) Supply Current Vs. Temperature (No Load,
                        Different Switching Frequencies)
Figure 5-6 Per Channel (IVDDA/B) Supply Current Vs. Temperature (No Load, Different Switching Frequencies)
UCC21331 IVCCI Quiescent Supply Current vs Temperature (No Load,
                        Input Low, No Switching)
Figure 5-8 IVCCI Quiescent Supply Current vs Temperature (No Load, Input Low, No Switching)
UCC21331 Output Resistance vs Temperature
Figure 5-10 Output Resistance vs Temperature
UCC21331 Propagation Delay vs VCCI
Figure 5-12 Propagation Delay vs VCCI
UCC21331 Propagation Delay Matching (tDM) vs VDD
Figure 5-14 Propagation Delay Matching (tDM) vs VDD
UCC21331 VDD
                            12-V UVLO Threshold vs Temperature
Figure 5-16 VDD 12-V UVLO Threshold vs Temperature
UCC21331 IN/EN
                        Hysteresis vs Temperature
Figure 5-18 IN/EN Hysteresis vs Temperature
UCC21331 IN/EN
                        High Threshold
Figure 5-20 IN/EN High Threshold
UCC21331 Dead
                        Time Matching vs Temperature (with RDT = 20 kΩ and 100
                        kΩ)
Figure 5-22 Dead Time Matching vs Temperature (with RDT = 20 kΩ and 100 kΩ)