SLUSCO3B September   2016  â€“ December 2021 UCC21521

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety-Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Switching Characteristics
    11. 6.11 Insulation Characteristics Curves
    12. 6.12 Typical Characteristics
  7. Parameter Measurement Information
    1. 7.1 Propagation Delay and Pulse Width Distortion
    2. 7.2 Rising and Falling Time
    3. 7.3 Input and Enable Response Time
    4. 7.4 Programmable Dead Time
    5. 7.5 Powerup UVLO Delay to OUTPUT
    6. 7.6 CMTI Testing
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 VDD, VCCI, and Under Voltage Lock Out (UVLO)
      2. 8.3.2 Input and Output Logic Table
      3. 8.3.3 Input Stage
      4. 8.3.4 Output Stage
      5. 8.3.5 Diode Structure in UCC21521
    4. 8.4 Device Functional Modes
      1. 8.4.1 Enable Pin
      2. 8.4.2 Programmable Dead Time (DT) Pin
        1. 8.4.2.1 Tying the DT Pin to VCC
        2. 8.4.2.2 DT Pin Connected to a Programming Resistor between DT and GND Pins
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Designing INA/INB Input Filter
        2. 9.2.2.2 Select External Bootstrap Diode and its Series Resistor
        3. 9.2.2.3 Gate Driver Output Resistor
        4. 9.2.2.4 Gate to Source Resistor Selection
        5. 9.2.2.5 Estimate Gate Driver Power Loss
        6. 9.2.2.6 Estimating Junction Temperature
        7. 9.2.2.7 Selecting VCCI, VDDA/B Capacitor
          1. 9.2.2.7.1 Selecting a VCCI Capacitor
          2. 9.2.2.7.2 Selecting a VDDA (Bootstrap) Capacitor
          3. 9.2.2.7.3 Select a VDDB Capacitor
        8. 9.2.2.8 Dead Time Setting Guidelines
        9. 9.2.2.9 Application Circuits with Output Stage Negative Bias
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Certifications
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Support Resources
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Application Curves

Figure 9-5 and Figure 9-6 shows the bench test waveforms for the design example shown in Figure 9-1 under these conditions: VCC = 5 V, VDD = 20 V, fSW = 100 kHz, VDC-Link = 0 V.

Channel 1 (Yellow): UCC21521 INA pin signal.

Channel 2 (Blue): UCC21521 INB pin signal.

Channel 3 (Pink): Gate-source signal on the high side power transistor.

Channel 4 (Green): Gate-source signal on the low side power transistor.

In Figure 9-5, INA and INB are sent complimentary 3.3-V, 50% duty-cycle signals. The gate drive signals on the power transistor have a 250-ns dead time, shown in the measurement section of Figure 9-5. The dead-time matching is less than 1 ns with the 250-ns dead-time setting.

Figure 9-6 shows a zoomed-in version of the waveform of Figure 9-5, with measurements for propagation delay and rising/falling time. Cursors are also used to measure dead time. Importantly, the output waveform is measured between the power transistors’ gate and source pins, and is not measured directly from the driver OUTA and OUTB pins. Due to the split on and off resistors (Ron,Roff) and different sink and source currents, different rising (16 ns) and falling time (9 ns) are observed in Figure 9-6.

GUID-61BDE919-4A37-42FC-BFC4-F4C32B10EC52-low.gifFigure 9-5 Bench Test Waveform for INA/B and OUTA/B
GUID-C85F8271-A190-4DCB-B898-AF4CC6A9BE68-low.gifFigure 9-6 Zoomed-In bench-test waveform