Refer to the PDF data sheet for device specific package drawings
Mechanical Data (Package|Pins)
DWK|14
Thermal pad, mechanical data (Package|Pins)
10.1.3 High-Voltage Considerations
To ensure isolation performance between the primary and secondary side, avoid placing any PCB traces or copper below the driver device. A PCB cutout is recommended in order to prevent contamination that may compromise the isolation performance.
For half-bridge or high-side/low-side configurations, maximize the clearance distance of the PCB layout between the high and low-side PCB traces.