SLUSEB4 Data sheet

SLUSEB4B August 2020 – February 2024 UCC21759-Q1

PRODUCTION DATA

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)

DW|16

Thermal pad, mechanical data (Package|Pins)

DW|16
- QFND505A

Orderable Information

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

PARAMETER			MIN	MAX	UNIT
VCC	VCC – GND		–0.3	6	V
VDD	VDD – COM		–0.3	36	V
VEE	VEE – COM		–17.5	0.3	V
V_MAX	VDD – VEE		–0.3	36	V
IN+, IN–, RST/EN		DC	GND–0.3	VCC	V
IN+, IN–, RST/EN		Transient, less than 100 ns⁽²⁾	GND–5.0	VCC+5.0	V
DESAT	Reference to COM		COM–0.3	VDD+0.3	V
AIN	Reference to COM		–0.3	5	V
OUTH, OUTL , CLMPI		DC	VEE–0.3	VDD	V
OUTH, OUTL , CLMPI		Transient, less than 100 ns⁽²⁾	VEE–5.0	VDD+5.0	V
RDY, FLT, APWM			GND–0.3	VCC	V
I_FLT, I_RDY	FLT, and RDY pin input current			20	mA
I_APWM	APWM pin output current			20	mA
T_J	Junction temperature range		–40	150	°C
T_stg	Storage temperature range		–65	150	°C

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) Values are verified by characterization on bench.