SLUSEB4B August   2020  – February 2024 UCC21759-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics
    10. 5.10 Switching Characteristics
    11. 5.11 Insulation Characteristics Curves
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Propagation Delay
      1. 6.1.1 Non-Inverting and Inverting Propagation Delay
    2. 6.2 Input Deglitch Filter
    3. 6.3 Active Miller Clamp
      1. 6.3.1 Internal On-chip Active Miller Clamp
    4. 6.4 Under Voltage Lockout (UVLO)
      1. 6.4.1 VCC UVLO
      2. 6.4.2 VDD UVLO
    5. 6.5 Desaturation (DESAT) Protection
      1. 6.5.1 DESAT Protection with Soft Turn-OFF
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Power Supply
      2. 7.3.2  Driver Stage
      3. 7.3.3  VCC and VDD Undervoltage Lockout (UVLO)
      4. 7.3.4  Active Pulldown
      5. 7.3.5  Short Circuit Clamping
      6. 7.3.6  Internal Active Miller Clamp
      7. 7.3.7  Desaturation (DESAT) Protection
      8. 7.3.8  Soft Turn-off
      9. 7.3.9  Fault ( FLT, Reset and Enable ( RST/EN)
      10. 7.3.10 Isolated Analog to PWM Signal Function
    4. 7.4 Device Functional Modes
  9. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input filters for IN+, IN- and RST/EN
        2. 8.2.2.2 PWM Interlock of IN+ and IN-
        3. 8.2.2.3 FLT, RDY and RST/EN Pin Circuitry
        4. 8.2.2.4 RST/EN Pin Control
        5. 8.2.2.5 Turn-On and Turn-Off Gate Resistors
        6. 8.2.2.6 Desaturation (DESAT) Protection
        7. 8.2.2.7 Isolated Analog Signal Sensing
          1. 8.2.2.7.1 Isolated Temperature Sensing
          2. 8.2.2.7.2 Isolated DC Bus Voltage Sensing
        8. 8.2.2.8 Higher Output Current Using an External Current Buffer
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

GUID-7B6338BE-1E3F-40BF-82B7-9E6708B2E476-low.gif UCC21759-Q1DW SOIC (16)Top View
Table 4-1 Pin Functions
PIN I/O(1) DESCRIPTION
NAME NO.
AIN 1 I Isolated analog sensing input, parallel a small capacitor to COM for better noise immunity. If not used, short to COM
DESAT 2 I Desaturation current protection input. If not used, short to COM
COM 3 P Common ground reference, connecting to emitter pin for IGBT or source pin for SiC-MOSFET
OUTH 4 O Gate driver output pull up
VDD 5 P Positive supply rail for gate drive voltage, Bypassing a >10μF capacitor to COM to support specified gate driver source peak current capability. Place decoupling capacitor close to the pin.
OUTL 6 O Gate driver output pull down
CLMPI 7 O Internal active Miller clamp, connecting this pin directly to the gate of the power transistor. If not used, short to VEE
VEE 8 P Negative supply rail for gate drive voltage. Bypassing a >10μF capacitor to COM to support specified gate driver sink peak current capability. Place decoupling capacitor close to the pin.
GND 9 P Input power supply and logic ground reference
IN+ 10 I Non-inverting gate driver control input. Tie to VCC if unused.
IN– 11 I Inverting gate driver control input. If not used, short to GND
RDY 12 O Power good for VCC-GND and VDD-COM. RDY is open drain configuration and can be paralleled with other RDY signals
FLT 13 O Active low fault alarm output upon over current or short circuit detection. FLT is in open drain configuration and can be paralleled with other faults
RST/EN 14 I The RST/EN serves two purposes:
1) Enable / shutdown of the output side. The FET is turned off by a regular turn-off, if terminal EN is set to low;
2) Resets the DESAT condition signaled on FLT pin. if terminal RST/EN is set to low for more than 1000ns. A reset of signal FLT is asserted at the rising edge of terminal RST/EN.
For automatic RESET function, this pin only serves as an EN pin. Enable / shutdown of the output side. The FET is turned off by a general turn-off, if terminal EN is set to low.
VCC 15 P Input power supply from 3V to 5.5V, bypassing a >1μF capacitor to GND. Place decoupling capacitor close to the pin.
APWM 16 O Isolated analog sensing PWM output. If not used, leave floating or tie a parallel capacitor to GND
(1) P = Power, G = Ground, I = Input, O = Output