SLUSDV7B October   2019  – March 2021 UCC23313-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Function
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Switching Characteristics
    11. 6.11 Insulation Characteristics Curves
    12. 6.12 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Propagation Delay, rise time and fall time
    2. 7.2 IOH and IOL testing
    3. 7.3 CMTI Testing
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power Supply
      2. 8.3.2 Input Stage
      3. 8.3.3 Output Stage
      4. 8.3.4 Protection Features
        1. 8.3.4.1 Undervoltage Lockout (UVLO)
        2. 8.3.4.2 Active Pulldown
        3. 8.3.4.3 Short-Circuit Clamping
    4. 8.4 Device Functional Modes
      1. 8.4.1 ESD Structure
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Selecting the Input Resistor
        2. 9.2.2.2 Gate Driver Output Resistor
        3. 9.2.2.3 Estimate Gate-Driver Power Loss
        4. 9.2.2.4 Estimating Junction Temperature
        5. 9.2.2.5 Selecting VCC Capacitor
      3. 9.2.3 Application Performance Plots
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 PCB Material
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DWY|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.12 Typical Characteristics

VCC= 15 V, 1-µF capacitor from VCC to VEE, CLOAD = 1 nF for timing tests and 180nF for IOH and IOL tests, TJ = –40°C to +150°C, (unless otherwise noted)

GUID-1233B7F5-A855-48F5-B6D0-3478537E0DE4-low.gif
CLOAD = 180-nF
Figure 6-3 Output Drive currents versus Temperature
GUID-41BF19C3-8E0B-4DAB-87B4-C684844E4A66-low.gifFigure 6-5 Supply current versus Supply Voltage
GUID-09382135-0AD9-460E-94C5-36B7A779B8B7-low.gif
CLOAD = 1-nF
Figure 6-7 Propagation delay versus Temperature
GUID-E5764D64-F5FB-4DB1-B6A6-A9E7B0AA29A8-low.gif
IOUT = 0mA
Figure 6-9 VOH (No Load) versus Temperature
GUID-AA9C16B2-324D-4D0F-AFC6-3A41CA7FD8D3-low.gif
IOUT = 20mA (sinking)
Figure 6-11 VOL versus Temperature
GUID-A58E43CB-7919-41C0-A696-712F1299BDB9-low.gifFigure 6-13 Supply current versus Frequency
GUID-D4D7D7C4-6E3B-4595-8553-AC394AD7F9DB-low.gif
IF = 10mA
Figure 6-15 Forward voltage drop versus Temperature
GUID-F5926BF7-2DCA-4DF9-AE4D-EE3582F8C62E-low.gifFigure 6-4 Supply currents versus Temperature
GUID-02D6B50A-16E7-4FD2-A349-F387CFE253FE-low.gifFigure 6-6 Forward threshold current versus Temperature
GUID-633F7E0F-9612-4673-B338-60E22216E176-low.gif
CLOAD = 1-nF
Figure 6-8 Propagation delay versus Forward current
GUID-082ABEBC-B614-4D70-9BEF-50F8B2E4B2A5-low.gif
IOUT = 20mA (sourcing)
Figure 6-10 VOH (20mA Load) versus Temperature
GUID-D4B9A130-5F7D-46B6-9191-52AC94BF6C98-low.gifFigure 6-12 Propagation delay versus Supply voltage
GUID-F723E995-2D3E-4BBB-92F1-22BB66A9BDAA-low.gif
TA = 25°C
Figure 6-14 Forward current versus Forward voltage drop