SLUSF58A December   2023  – April 2024 UCC23525

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Function
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety Limiting Values
    8. 5.8  Electrical Characteristics
    9. 5.9  Switching Characteristics
    10. 5.10 Thermal Derating Curves
    11. 5.11 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Propagation Delay, Rise Time and Fall Time
    2. 6.2 IOH and IOL Testing
    3. 6.3 CMTI Testing
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Supply
      2. 7.3.2 Input Stage
      3. 7.3.3 Output Stage
      4. 7.3.4 Protection Features
        1. 7.3.4.1 Undervoltage Lockout (UVLO)
        2. 7.3.4.2 Active Pulldown
        3. 7.3.4.3 Short-Circuit Clamping
        4. 7.3.4.4 ESD Structure
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Selecting the Input Resistor
        2. 8.2.2.2 Gate Driver Output Resistor
        3. 8.2.2.3 Estimate Gate-Driver Power Loss
        4. 8.2.2.4 Estimating Junction Temperature
        5. 8.2.2.5 Selecting VDD Capacitor
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 PCB Material
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Package Option Addendum
    2. 13.2 Tape and Reel Information
    3. 13.3 Mechanical Data

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DWY|6
Thermal pad, mechanical data (Package|Pins)

5.8 Electrical Characteristics

Over recommended operating conditions unless otherwise noted. All typical values are at TA = 25°C, VDD–VSS= 15V.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
INPUT
IFLH Input Forward Threshold Current Low to High VDD - VSS = 15V 1 2.5 mA
VF Input Forward Voltage  IF =10 mA 1.4 1.7 2 V
ΔVF/ΔT Temp Coefficient of Input Forward Voltage  IF =10 mA 0.7 mV/ºC
VR Input Reverse Breakdown Voltage IR= 10 uA 6 V
CIN Input Capacitance F = 0.5 MHz 4 pF
OUTPUT
IOH Output Peak Source Current CLoad=220nF -5 A
IOL Output Peak Sink Current CLoad=220nF 5 A
ROH Output Pull-up Resistance IO = -1A 2.5 3.5 Ω
ROL Output Pull-down Resistance IO = 1A 0.7 1.5 Ω
IDD_H Output Supply Current (Diode On) IF = 10 mA, IO= 0 mA 2.2 mA
IDD_L Output Supply Current (Diode Off) VF = 0 V, IO= 0 mA 2 mA
UNDER VOLTAGE LOCKOUT
UVLOR Under Voltage Lockout VDD rising (12V UVLO) IF=10 mA 11.4 12 12.6 V
UVLOF Under Voltage Lockout VDD falling (12V UVLO) IF=10 mA 10.45 11 11.55 V
UVLOHYS UVLO Hysteresis (12V UVLO) IF=10 mA 1.0 V
VDD_UVLO_FIL VDD UVLO Deglitch Time  VDD>5.3V 5 μs